Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices

Abstract:
The world's leading scientists and engineers in micro and nanoelectronics will convene here from December 15-17, 2014 at the annual IEEE International Electron Devices Meeting (IEDM), continuing the conference's tradition of spotlighting technical breakthroughs in a wide range of applications such as logic, memory, MEMs, sensors, displays, flexible electronics, biomedical imaging, power electronics and energy harvesting.

IEEE International Electron Devices Meeting To Celebrate 60th Anniversary as The Leading Technical Conference for Advanced Semiconductor Devices

San Francisco, CA | Posted on September 18th, 2014

The 60th annual IEDM will take place at the Hilton San Francisco Union Square Hotel, preceded by day-long short courses on Sunday, Dec. 14 and a program of 90-minute tutorials on Saturday, Dec. 13. In addition to the technical program, other events such as evening panels, special focus sessions, IEEE awards and an entrepreneurial session will take place during the meeting.

The heart of every IEDM technical program is a focus on core semiconductor technology, but, in keeping with the growth in mobile computing and communications, and with the expansion of electronics into many new areas, the 2014 meeting will have a greater overall emphasis on circuit and process technology interactions, bio-sensors and bioMEMS, energy harvesting, power devices, sensors, magnetics, spintronics, two-dimensional electronics, devices for non-Boolean computing, and multiferroics.

Many papers on these topics will be given in regular sessions throughout the conference, while others will be grouped in these designated focus sessions:
- Advanced Displays
- Analog Circuits and Devices
- Bio-MEMS
- Power Devices and Applications

"The IEDM conference has long been the place where the world's experts have presented breakthroughs in transistors, memory devices and related semiconductor technologies," said Suman Datta, IEDM 2014 Publicity Chair and Professor of Electrical Engineering at Penn State University. "The tradition of attracting the best speakers and a large, diverse audience from around the world continues as we mark the conference's 60th anniversary, with an added focus on emerging areas of importance where semiconductor technology is expected to play an expanding and enabling role."

The 2014 IEDM technical program* comprises some 213 presentations. It features talks exploring topics such as:
- how advanced power semiconductors are helping the world save huge amounts of energy while dramatically reducing greenhouse gas emissions;
- how MEMS technology is driving advances in understanding the pathophysiology of Alzheimer's Disease, and is enabling faster, cheaper, better DNA sequencing;
- how silicon thin-film transistors can be built on arbitrary substrates like paper or cheap plastics;
- how efficient energy-storage devices can be made using porous silicon and integrated with electronic circuitry on a single chip;
- ways in which CMOS scaling will be extended effectively to the 10-nm node and beyond;
- new memories, various types of 3D circuits, and many other topics that are both fascinating and fundamental to the advancement of a sustainable digital future for humanity.
*A Tip Sheet is available with more information on these and many other technical highlights.

Here are some of the noteworthy events that will take place at this year's IEDM:

90-Minute Tutorials -- Saturday, Dec. 13
A program of 90-minute tutorial sessions on emerging topics will be presented by experts in the fields. They are meant to bridge the gap between textbook-level knowledge and leading-edge current research. The tutorials will be presented in parallel in two time slots. Advance registration is required.
- Physical Characterization of Novel Materials and Devices for Logic and Memory, by W. Vandervorst and D. Cooper from Imec
- Reliability Characteristics of CMOS Transistors Post Si/SiO2/poly-Si Gate Stack Scaling, by Eduard Cartier from IBM Research
- Power Semiconductor Device Basics: History, Application and Physics, by Ichiro Omura from Kyushu Institute of Technology
- Power Electronics for a Smart Energy Future, by Johan Driesen from KU Leuven
- Nonvolatile Memories: Old and New, by Jan Van Houdt from Imec
- Optoelectronics of Graphene and other 2D Materials, by Phaedon Avouris from IBM Research

Short Courses -- Sunday, Dec. 14
The IEDM will host two Sunday short courses, providing the opportunity to learn about important areas and developments, and to benefit from direct contact with expert lecturers. Advance registration is required. This year's courses are:
- Challenges of 7nm CMOS Technology, organized by Hidenobu Fukutome from Samsung
- 3D System Integration Technology, organized by Eric Beyne from Imec

Plenary Presentations -- Monday, Dec. 15
IEDM 2014 will open on Monday, Dec. 15 at 9 a.m. with these three plenary talks:
- SiC MOSFET Development for Industrial Markets, by John Palmour from Cree Inc.
- Are 3D Atomic Printers Around the Corner? by Enrico Prati from CNR IMM (Italy's Institute for Microelectronics and Microsystems)
- Research into ADAS with Driving Intelligence for Future Innovation by Hideo Inoue from Toyota

Luncheon Presentation -- Tuesday, Dec. 16
The IEDM Luncheon presentation will be given by T. J. Rodgers, the founder, President, CEO and a director of Cypress Semiconductor Corporation.

Evening Panel Sessions -- Tuesday evening, Dec. 16
The IEDM offers attendees two evening panel discussions. Audience participation is encouraged to foster an open and vigorous exchange of ideas. The panel topics are:
- 60 Years of IEDM and Counting, moderated by Krishna Saraswat from Stanford.
- The Semiconductor Industry in 2024, moderated by Thomas Theis from IBM.

Entrepreneurs Lunch -- Wednesday noon, Dec. 17
Jointly sponsored by IEDM and IEEE Women in Engineering, the IEDM Entrepreneurs Lunch is back for a third year. The speaker will be Kathryn Kranen, Corporate Vice President and General Manager at Cadence Design Systems, Inc. Ms. Kranen will discuss how she led two start-ups to success, in each case transforming an emerging technology into a mainstream one. She did that with Verisity Design, Inc. and with Jasper Design Automation, Inc., both of which subsequently were acquired by Cadence. She had been CEO at both companies. Ms. Kranen was awarded the ACE Lifetime Achievement Award in 2013 for contributions to the electronics industry.

Further information
For registration and other information, visit the IEDM 2014 home page www.ieee-iedm.org, or contact:

####

For more information, please click here

Contacts:
Phyllis Mahoney, Conference Manager
Widerkehr & Associates
19803 Laurel Valley Place
Montgomery Village, MD 20886
e-mail:
telephone (301) 527-0900 ext. 2
fax: (301) 527-0994

Follow IEDM via social media
- Twitter: twitter.com/#!/ieee_iedm | @ieee_iedm
- Facebook: http://www.facebook.com/IEEE.IEDM

Copyright © IEEE

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Imaging

New material to make next generation of electronics faster and more efficient With the increase of new technology and artificial intelligence, the demand for efficient and powerful semiconductors continues to grow November 8th, 2024

UC Irvine scientists create material that can take the temperature of nanoscale objects: The technology can track small temp changes in electronic devices, biological cells August 16th, 2024

Flexible Electronics

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

News and information

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Display technology/LEDs/SS Lighting/OLEDs

Enhancing electron transfer for highly efficient upconversion: OLEDs Researchers elucidate the mechanisms of electron transfer in upconversion organic light-emitting diodes, resulting in improved efficiency August 16th, 2024

Efficient and stable hybrid perovskite-organic light-emitting diodes with external quantum efficiency exceeding 40 per cent July 5th, 2024

New organic molecule shatters phosphorescence efficiency records and paves way for rare metal-free applications July 5th, 2024

MEMS

Bosch launches longevity program for industrial and IoT applications: High-performance accelerometer, IMU and pressure sensor with 10-year availability July 23rd, 2020

CEA-Leti Develops Tiny Photoacoustic-Spectroscopy System For Detecting Chemicals & Gases: Paper at Photonics West to Present Detector that Could Cost 10x Less Than Existing Systems and Prompt Widespread Use of the Technology February 4th, 2020

MEMS & Sensors Executive Congress Technology Showcase Finalists Highlight Innovations in Automotive, Biomedical and Consumer Electronics: MSIG MEMS & Sensors Executive Congress – October 22-24, 2019, Coronado, Calif. October 1st, 2019

ULVAC Launches Revolutionary PZT Piezoelectric Thin-film Process Technology and HVM Solution for MEMS Sensors/Actuators: Enabling Reliable, High-quality Film Production for Next Generation Devices August 16th, 2019

Spintronics

Researchers discover a potential application of unwanted electronic noise in semiconductors: Random telegraph noises in vanadium-doped tungsten diselenide can be tuned with voltage polarity August 11th, 2023

Quantum materials: Electron spin measured for the first time June 9th, 2023

Rensselaer researcher uses artificial intelligence to discover new materials for advanced computing Trevor Rhone uses AI to identify two-dimensional van der Waals magnets May 12th, 2023

Spin photonics to move forward with new anapole probe November 4th, 2022

Chip Technology

New material to make next generation of electronics faster and more efficient With the increase of new technology and artificial intelligence, the demand for efficient and powerful semiconductors continues to grow November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

New discovery aims to improve the design of microelectronic devices September 13th, 2024

Groundbreaking precision in single-molecule optoelectronics August 16th, 2024

Memory Technology

Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024

Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023

Researchers discover materials exhibiting huge magnetoresistance June 9th, 2023

Rensselaer researcher uses artificial intelligence to discover new materials for advanced computing Trevor Rhone uses AI to identify two-dimensional van der Waals magnets May 12th, 2023

Sensors

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

Groundbreaking precision in single-molecule optoelectronics August 16th, 2024

Announcements

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Turning up the signal November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

Tools

New material to make next generation of electronics faster and more efficient With the increase of new technology and artificial intelligence, the demand for efficient and powerful semiconductors continues to grow November 8th, 2024

Turning up the signal November 8th, 2024

Quantum researchers cause controlled ‘wobble’ in the nucleus of a single atom September 13th, 2024

Faster than one pixel at a time – new imaging method for neutral atomic beam microscopes developed by Swansea researchers August 16th, 2024

Energy

KAIST researchers introduce new and improved, next-generation perovskite solar cell​ November 8th, 2024

Unveiling the power of hot carriers in plasmonic nanostructures August 16th, 2024

Groundbreaking precision in single-molecule optoelectronics August 16th, 2024

Development of zinc oxide nanopagoda array photoelectrode: photoelectrochemical water-splitting hydrogen production January 12th, 2024

Battery Technology/Capacitors/Generators/Piezoelectrics/Thermoelectrics/Energy storage

Giving batteries a longer life with the Advanced Photon Source: New research uncovers a hydrogen-centered mechanism that triggers degradation in the lithium-ion batteries that power electric vehicles September 13th, 2024

What heat can tell us about battery chemistry: using the Peltier effect to study lithium-ion cells March 8th, 2024

Two-dimensional bimetallic selenium-containing metal-organic frameworks and their calcinated derivatives as electrocatalysts for overall water splitting March 8th, 2024

Discovery of new Li ion conductor unlocks new direction for sustainable batteries: University of Liverpool researchers have discovered a new solid material that rapidly conducts lithium ions February 16th, 2024

Events/Classes

A New Blue: Mysterious origin of the ribbontail ray’s electric blue spots revealed July 5th, 2024

Researchers demonstrate co-propagation of quantum and classical signals: Study shows that quantum encryption can be implemented in existing fiber networks January 20th, 2023

CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium: Invited paper reports 3-step characterization chain and resulting methodologies and metrics that accelerate learning, provide data on device pe June 17th, 2022

June Conference in Grenoble, France, to Explore Pathways to 6G Applications, Including ‘Internet of Senses’, Sustainability, Extended Reality & Digital Twin of Physical World: Organized by CEA-Leti, the Joint EuCNC and 6G Summit Sees Telecom Sector as an ‘Enabler for a Sustainabl June 1st, 2022

Alliances/Trade associations/Partnerships/Distributorships

Manchester graphene spin-out signs $1billion game-changing deal to help tackle global sustainability challenges: Landmark deal for the commercialisation of graphene April 14th, 2023

Chicago Quantum Exchange welcomes six new partners highlighting quantum technology solutions, from Chicago and beyond September 23rd, 2022

CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium: Invited paper reports 3-step characterization chain and resulting methodologies and metrics that accelerate learning, provide data on device pe June 17th, 2022

University of Illinois Chicago joins Brookhaven Lab's Quantum Center June 10th, 2022

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project