Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > Dream Chip Technologies Presents First 22nm FD-SOI Silicon of New Automotive Driver Assistance SoC: Advanced driver assistance system (ADAS) computer vision SoC developed for European THINGS2DO project with working first silicon fabricated on GLOBALFOUNDRIES’ 22nm FD-SOI Platfor

Abstract:
Dream Chip Technologies announced today the presentation of the industry`s first 22nm FD-SOI silicon for a new ADAS System-on-Chip (SoC) for automotive computer vision applications at the Mobile World Congress in Barcelona. The SoC was created in close cooperation with ARM, Arteris, Cadence, GLOBALFOUNDRIES, and INVECAS as part of the European Commission’s ENIAC THINGS2DO reference development platform.

Dream Chip Technologies Presents First 22nm FD-SOI Silicon of New Automotive Driver Assistance SoC: Advanced driver assistance system (ADAS) computer vision SoC developed for European THINGS2DO project with working first silicon fabricated on GLOBALFOUNDRIES’ 22nm FD-SOI Platfor

Hanover, Germany | Posted on February 27th, 2017

The SoC offers high performance image acquisition and processing capabilities and supports convolutional neural network (CNN) vision workloads to meet the demand for complex automotive object detection and processing. This ADAS SoC is highly optimized for high-end computer vision performance at a very low-power consumption to enable autonomous driving in production and is capable to support ADAS functions like road-sign recognition, lane departure warning, driver distraction warning, blind spot detection, surround vision, park assist, pedestrian detection, cruise control and emergency braking.”

The design incorporates Dream Chip Technologies’ image signal processing pipeline in conjunction with Cadence Tensilica Vision P6 DSPs and a quad-core cluster of ARM® Cortex®-A53 processors. In addition, a lock-step pair of Cortex-R5 processors provides ISO 26262 compliant functional safety and the SoC is interconnected with an Arteris FlexNoC network-on-chip. The SoC uses multiple IPs such as foundation IPs, LPDDR4, PLL, Thermal Sensor and Process Monitor, from INVECAS. Cadence’s LPDDR4 controller and INVECAS’ LPDDR4 PHY IP provide two LPDDR4 3200 high bandwidth memory interfaces.

Dr. Jens Benndorf, Managing Director and Co-Founder of DCT said: “It was a unique experience to create and coordinate such a powerful team and successfully lead the consortium to two tape-outs. In this project, we have delivered silicon using a brand new process technology for the automotive industry.” He adds: “The project not only shows the strength of the European semiconductor industry, but also an ability to collaborate efficiently to provide technology needed urgently by the industry to power advanced automated driving solutions.”

Dream Chip Technologies has designed many highly complex SoCs for customers worldwide and was selected as the design service lead for this THINGS2DO project. The project has created a camera-based ADAS reference platform which benefits automotive companies through advanced technology and by shortening design cycles and time-to-market for automotive innovation. The SoC is fabricated on GF’s 22FDX® semiconductor process at the foundry’s Fab 1 facility in Dresden, Germany.

The new ADAS platform is targeted at automotive Tier-1s with a need for cost, performance and power-optimized SoCs for a range of ADAS applications and with potential for customization.

The choice of a quad-core Cortex-A53 processor configuration is a popular choice for computer vision applications to manage automotive vision applications. More advanced autonomous driving systems can also be enabled with this level of computer vision capability, including those using multiple smart cameras.

“This project provides a boost for European chip designers focused on solving some of the automotive world’s most complex problems,” said Nandan Nayampally, general manager, CPU Group, ARM. “By using a quad-core ARM Cortex-A53 configuration, with the Cortex-R5 fortifying the safety critical aspects, Dream Chip has produced a highly efficient and functionally safe processing solution that sets a high bar in the automotive vision sector. It underlines the rapidly increasingly deployment of ARM technology in vehicles; ranging from detection sensors to infotainment, ADAS and autonomous driving.”

“ADAS features are exhibiting the highest growth within the automotive electronics domain as vehicle makers look to differentiate on enhanced products that provide real-time vision processing," said Rajeev Rajan, vice president of IoT and Automotive at GF. “GF’s 22FDX is an ideal platform to design power- and performance-efficient solutions for automotive vision and camera ADAS applications. As an industry first, this milestone affirms our commitment to support and collaboratively shape automotive markets.”

Dasaradha Gude, CEO of INVECAS said: “We are excited to contribute to this program as this collaboration further strengthens INVECAS’ position as a key provider of silicon proven IPs for GLOBALFOUNDRIES’ 22FDX technology. INVECAS’ rich family of IP offerings ranging from Foundation IP, Interface IP like Multiprotocol SerDes, DDR34/LPDDR34, MIPI, HDMI etc. enables complex SoC designs for the automotive market addressing the next wave of connected car opportunities in Europe. Our objective is to provide silicon-proven IP and ASIC solutions to address the challenges of ever growing design complexity faced by the semiconductor industry today.”

####

For more information, please click here

Copyright © GLOBALFOUNDRIES

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Chip Technology

New material to make next generation of electronics faster and more efficient With the increase of new technology and artificial intelligence, the demand for efficient and powerful semiconductors continues to grow November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

New discovery aims to improve the design of microelectronic devices September 13th, 2024

Groundbreaking precision in single-molecule optoelectronics August 16th, 2024

Announcements

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Turning up the signal November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

Automotive/Transportation

Giving batteries a longer life with the Advanced Photon Source: New research uncovers a hydrogen-centered mechanism that triggers degradation in the lithium-ion batteries that power electric vehicles September 13th, 2024

Researchers’ approach may protect quantum computers from attacks March 8th, 2024

New designs for solid-state electrolytes may soon revolutionize the battery industry: Scientists achieve monumental improvements in lithium-metal-chloride solid-state electrolytes November 3rd, 2023

Previously unknown pathway to batteries with high energy, low cost and long life: Newly discovered reaction mechanism overcomes rapid performance decline in lithium-sulfur batteries September 8th, 2023

Events/Classes

A New Blue: Mysterious origin of the ribbontail ray’s electric blue spots revealed July 5th, 2024

Researchers demonstrate co-propagation of quantum and classical signals: Study shows that quantum encryption can be implemented in existing fiber networks January 20th, 2023

CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium: Invited paper reports 3-step characterization chain and resulting methodologies and metrics that accelerate learning, provide data on device pe June 17th, 2022

June Conference in Grenoble, France, to Explore Pathways to 6G Applications, Including ‘Internet of Senses’, Sustainability, Extended Reality & Digital Twin of Physical World: Organized by CEA-Leti, the Joint EuCNC and 6G Summit Sees Telecom Sector as an ‘Enabler for a Sustainabl June 1st, 2022

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project