Home > Press > Leti Workshop at IEDM 2013 Will Present Latest Advances in Cost-effective and Power-efficient Technologies for the Future of the Semiconductor Industry
Abstract:
CEA-Leti will kick off its participation in IEDM 2013 in Washington, D.C., on Dec. 8th with a workshop for invited guests on key technologies for future applications in the chip industry. A networking event will follow the workshop.
In addition to short presentations on Leti's latest results in the selected topics, the workshop will include a summary of Leti's technology roadmap for the next 10 years.
Topics for the event include:
· Lithography cost-effective solutions for 1X nodes
· 3D: dream and reality
· High-performance, reliable resistive memories embedded in advanced logic CMOS technologies
· M&NEMS platforms: an enabler for the next generation of sensors in consumer electronics
· CMOS technologies: our most power-efficient solution today and our vision toward the 10nm node and beyond
Discussions, networking and cocktails will follow the presentations.
Committed to developing disruptive technologies for its industrial partners, Leti plans 10-15 years ahead to provide solutions that will meet future demands for technology in a variety of domains.
At this year's conference, Leti, which pioneered FDSOI technology in the early 1990s and helped demonstrate its power-efficiency superiority, will present its recent results through various papers (including two invited ones) focused on next-generation CMOS and memory components.
####
About CEA-Leti
By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo.
For more information, please click here
Contacts:
CEA-Leti
+33 4 38 78 02 26
Agency
+33 6 64 52 81 10
Copyright © CEA-Leti
If you have a comment, please Contact us.Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Related News Press |
News and information
Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024
Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
NEMS
IEDM - CEA-Leti Will Present 11 Papers and Host Workshop on Disruptive Technologies for Data Management November 7th, 2018
UT engineers develop first method for controlling nanomotors: Breakthrough for nanotechnology as UT engineers develop first method for switching the mechanical motion of nanomotors September 21st, 2018
Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication July 13th, 2018
One string to rule them all April 17th, 2018
MEMS
Chip Technology
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
New discovery aims to improve the design of microelectronic devices September 13th, 2024
Groundbreaking precision in single-molecule optoelectronics August 16th, 2024
Memory Technology
Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Researchers discover materials exhibiting huge magnetoresistance June 9th, 2023
Announcements
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
Turning up the signal November 8th, 2024
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
Events/Classes
A New Blue: Mysterious origin of the ribbontail ray’s electric blue spots revealed July 5th, 2024
Researchers demonstrate co-propagation of quantum and classical signals: Study shows that quantum encryption can be implemented in existing fiber networks January 20th, 2023
Printing/Lithography/Inkjet/Inks/Bio-printing/Dyes
Presenting: Ultrasound-based printing of 3D materials—potentially inside the body December 8th, 2023
Simple ballpoint pen can write custom LEDs August 11th, 2023
Disposable electronics on a simple sheet of paper October 7th, 2022
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||