Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > Leti Workshop at IEDM 2013 Will Present Latest Advances in Cost-effective and Power-efficient Technologies for the Future of the Semiconductor Industry

Abstract:
CEA-Leti will kick off its participation in IEDM 2013 in Washington, D.C., on Dec. 8th with a workshop for invited guests on key technologies for future applications in the chip industry. A networking event will follow the workshop.

In addition to short presentations on Leti's latest results in the selected topics, the workshop will include a summary of Leti's technology roadmap for the next 10 years.

Leti Workshop at IEDM 2013 Will Present Latest Advances in Cost-effective and Power-efficient Technologies for the Future of the Semiconductor Industry

Grenoble, France | Posted on November 6th, 2013

Topics for the event include:

· Lithography cost-effective solutions for 1X nodes

· 3D: dream and reality

· High-performance, reliable resistive memories embedded in advanced logic CMOS technologies

· M&NEMS platforms: an enabler for the next generation of sensors in consumer electronics

· CMOS technologies: our most power-efficient solution today and our vision toward the 10nm node and beyond

Discussions, networking and cocktails will follow the presentations.

Committed to developing disruptive technologies for its industrial partners, Leti plans 10-15 years ahead to provide solutions that will meet future demands for technology in a variety of domains.

At this year's conference, Leti, which pioneered FDSOI technology in the early 1990s and helped demonstrate its power-efficiency superiority, will present its recent results through various papers (including two invited ones) focused on next-generation CMOS and memory components.

####

About CEA-Leti
By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo.

For more information, please click here

Contacts:
CEA-Leti
+33 4 38 78 02 26


Agency
+33 6 64 52 81 10

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

NEMS

IEDM - CEA-Leti Will Present 11 Papers and Host Workshop on Disruptive Technologies for Data Management November 7th, 2018

UT engineers develop first method for controlling nanomotors: Breakthrough for nanotechnology as UT engineers develop first method for switching the mechanical motion of nanomotors September 21st, 2018

Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication July 13th, 2018

One string to rule them all April 17th, 2018

MEMS

Bosch launches longevity program for industrial and IoT applications: High-performance accelerometer, IMU and pressure sensor with 10-year availability July 23rd, 2020

CEA-Leti Develops Tiny Photoacoustic-Spectroscopy System For Detecting Chemicals & Gases: Paper at Photonics West to Present Detector that Could Cost 10x Less Than Existing Systems and Prompt Widespread Use of the Technology February 4th, 2020

MEMS & Sensors Executive Congress Technology Showcase Finalists Highlight Innovations in Automotive, Biomedical and Consumer Electronics: MSIG MEMS & Sensors Executive Congress – October 22-24, 2019, Coronado, Calif. October 1st, 2019

ULVAC Launches Revolutionary PZT Piezoelectric Thin-film Process Technology and HVM Solution for MEMS Sensors/Actuators: Enabling Reliable, High-quality Film Production for Next Generation Devices August 16th, 2019

Chip Technology

New material to make next generation of electronics faster and more efficient With the increase of new technology and artificial intelligence, the demand for efficient and powerful semiconductors continues to grow November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

New discovery aims to improve the design of microelectronic devices September 13th, 2024

Groundbreaking precision in single-molecule optoelectronics August 16th, 2024

Memory Technology

Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024

Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023

Researchers discover materials exhibiting huge magnetoresistance June 9th, 2023

Rensselaer researcher uses artificial intelligence to discover new materials for advanced computing Trevor Rhone uses AI to identify two-dimensional van der Waals magnets May 12th, 2023

Announcements

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Turning up the signal November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

Events/Classes

A New Blue: Mysterious origin of the ribbontail ray’s electric blue spots revealed July 5th, 2024

Researchers demonstrate co-propagation of quantum and classical signals: Study shows that quantum encryption can be implemented in existing fiber networks January 20th, 2023

CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium: Invited paper reports 3-step characterization chain and resulting methodologies and metrics that accelerate learning, provide data on device pe June 17th, 2022

June Conference in Grenoble, France, to Explore Pathways to 6G Applications, Including ‘Internet of Senses’, Sustainability, Extended Reality & Digital Twin of Physical World: Organized by CEA-Leti, the Joint EuCNC and 6G Summit Sees Telecom Sector as an ‘Enabler for a Sustainabl June 1st, 2022

Printing/Lithography/Inkjet/Inks/Bio-printing/Dyes

Presenting: Ultrasound-based printing of 3D materials—potentially inside the body December 8th, 2023

Simple ballpoint pen can write custom LEDs August 11th, 2023

Disposable electronics on a simple sheet of paper October 7th, 2022

Newly developed technique to improve quantum dots color conversion performance: Researchers created perovskite quantum dot microarrays to achieve better results in full-color light-emitting devices and expand potential applications June 10th, 2022

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project