Home > Press > Intel Senior Fellow to be Keynote Speaker at CS Europe Conference: Robert Chau will also be presenting on “Integration of silicon CMOS with III-Vs.”
Abstract:
Robert S. Chau, Intel Senior Fellow, Technology and Manufacturing Group Director, Transistor Research and Nanotechnology, Intel Corporation will act as Key Note Speaker at the CS Europe Conference, March 2012, Frankfurt.
Defining the next steps for the Compound Semiconductor Industry
Following the success of CS Europe 2011, next year's conference is expanding to 2 days and offers a fantastic mix/quality of speakers making it the must attend industry event for 2012.
Please register at www.cseurope.net and remember to book your delegate place now as numbers will be limited.
The conference will take place on 12th and 13th March 2012 at the Hilton Hotel, Frankfurt, Germany.
It will feature a mix of insightful market research presentations and cutting-edge research destined to shape tomorrow's compound semiconductor industry.
Conference schedule:
12th March 2012 am : "CS Europe 2012: Markets and III-V CMOS Conference"
Talks will include:
Compound Semiconductor Markets: Current Status and Future Prospects - Asif Anwar, Director - Strategic Technologies Practice, Strategy Analytics
The Market for LEDs in Lighting - Mr. Philip Smallwood, Lighting Market Analyst, IMS Research
Wide Bandgap device market update - Dr. Philippe Roussel, Senior Project Manager, Yole Développement
European efforts to develop III-Vs on 200 and 300 mm silicon - Dr. Matty Caymax, Chief Scientist, imec
The Integration of silicon CMOS with III-Vs - Professor Iain Thayne, University of Glasgow
Progress of Sematech to develop III-Vs on 200 mm silicon - Richard Hill, Sematech
III-V 3D Transistors - Peide Ye, Professor of Electrical and Computer Engineering, Purdue University
12th March 2012 pm & 13th March - full day : "CS Europe 2012: LEDs, lasers, PV and electronics Conference"
This day and a half will concentrate on presentations involving industry mainly from the chipmaker sector.
Integration of silicon CMOS with III-Vs - Robert S. Chau, Intel Senior Fellow
SiC and GaN Electronics - Dr. John Palmour, Cree co-founder and chief technology officer, Power & RF
Ammono's ammonothermal method to make GaN substrates - Dr. Robert Dwiliński, President, CEO, Ammonno S.A.
Tomorrow's RF chips for mobile devices - Todd Gillenwater, VP of Technology and Advanced Development,
FMD
Building a Successful III-V Pure Play Foundry - Dr. John Atherton, WIN Semiconductors
Scalable "on-silicon" solutions (GaN-on-Si and Ge-on-Si) using rare oxide buffer layers - Dr. Michael Lebby, General Manager & Chief Technology Officer, Translucent Inc.
III-Nitride Lasers Based on Nonpolar/Semipolar Substrates - James W. Raring, VP of Laser Engineering, Soraa Inc.
Markets and Applications for SiC Transistors - Dieter Liesabeths, Vice President Sales & Marketing, SemiSouth Laboratories, Inc.
Perspective of an LED Manufacturer - Iain Black, Philips Lumileds Lighting Company
JDSU's role in the CPV Market following its acquisition of Quantasol technology - Jan-Gustav Werthen, JDSU
Commercialisation of GaN on SI based Power Devices at International Rectifier - Dr. Michael A. Briere, International Rectifier
Nitrides for base stations - Professor Rik Jos, NXP
Approach to MOCVD vacuum & Abatement - Mike Czerniak, EdwardsVacuum Ltd
Advances in Wide Bandgap Semiconductors for Power Electronics - Dr. Markus Behet, Dow Corning
Large diameter GaN-on-Si epiwafers for power electronics - EpiGaN
Tomorrow's RF chips for mobile devices - TriQuint
There will also be presentations by
Evatec Ltd.
EVG Group
####
For more information, please click here
Contacts:
Stephen Whitehurst
Chief Operating Officer
CS Europe Conference
Tel: +44 (0)2476 718970
Copyright © CS Europe Conference
If you have a comment, please Contact us.Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Related News Press |
News and information
Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024
Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
Chip Technology
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
New discovery aims to improve the design of microelectronic devices September 13th, 2024
Groundbreaking precision in single-molecule optoelectronics August 16th, 2024
Nanoelectronics
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022
Reduced power consumption in semiconductor devices September 23rd, 2022
Atomic level deposition to extend Moore’s law and beyond July 15th, 2022
Announcements
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
Turning up the signal November 8th, 2024
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
Events/Classes
A New Blue: Mysterious origin of the ribbontail ray’s electric blue spots revealed July 5th, 2024
Researchers demonstrate co-propagation of quantum and classical signals: Study shows that quantum encryption can be implemented in existing fiber networks January 20th, 2023
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||