Home > Press > China Semiconductor Technology International Conference (CSTIC 2012)
Abstract:
Conference Date and Venue
March 18-19, 2012
Kerry Hotel Pudong (The Shangri-la Group), Shanghai, China
Important Deadlines
Abstract Deadline: October 30, 2011
Manuscript Deadline: December 16, 2011
Abstract Submission
semiconchina.semi.org/cstic
China Semiconductor Technology International Conference (CSTIC 2012)
Shanghai, China | Posted on October 20th, 2011CSTIC is the largest annual industrial semiconductor technology conference in China. It is organized by SEMI and ECS, co-organized by China's High-Tech Expert Committee (CHTEC) and co-sponsored by IEEE, MRS and China Electronics Materials Industry Association. We are soliciting papers from around the world on all aspects of semiconductor technology and manufacturing. Original and overview papers from integrated device manufacturers (IDMs), materials suppliers and equipment vendors as well as academic and research institutes are particularly welcome. Prospective authors should submit a 200-500 words abstract and a brief bio to the conference Call for Papers site by October 30, 2011. The abstract template is available on the conference website. The abstract submission website remains open until October 30, 2011.
CSTIC aims to provide an enabling platform for executives, managers, engineers and researchers to exchange the latest developments in semiconductor technology and manufacturing. It also offers opportunities for those who are interested in investing in the semiconductor industry in Asia, particularly in China.
The CSTIC 2012 will continue to be held in conjunction with SEMICON China in Shanghai--one of the fastest growing regions in semiconductor manufacturing in the world. We look forward to seeing you in Shanghai next spring.
Topics to be addressed at CSTIC 2012 include, but not limited to, the following:
Symposium I: Design and Device Engineering
Symposium II: Lithography and Patterning
Symposium III: Dry &Wet Etch and Cleaning
Symposium IV: Thin Film Technology
Symposium V: CMP and Post-CMP Cleaning
Symposium VI: Materials and Process Integration for Device and Interconnection
Symposium VII: Packaging and Assembly
Symposium VIII: Metrology, Reliability and Testing
Symposium IX: Emerging Semiconductor Technologies
Symposium X: Advances in MEMS and Sensor Technologies
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