Home > News > Finding Solutions to Continued Scaling Efforts
February 6th, 2007
Finding Solutions to Continued Scaling Efforts
Abstract:
Chen's discussion of variability was not about the chip-to-chip, wafer-to-wafer or lot-to-lot variability, which can be solved. Also, regional variability — both systematic and random — can be solved as well. "The most important problem that we can't solve is the local systematic and random variability," he said. "It's what's going to kill technology advancement in this industry."
With this in mind, Chen turned his attention toward plans for the future — with options being to extend silicon CMOS (plan A), subsystem integration (plan B) or investing in non-silicon FETs or beyond FETs (plan C). Plan B shows some promise, Chen noted, pointing to such schemes as board-level optical interconnects and, more importantly, 3-D integration. Although 3-D integration has been used at the packaging level for several years, considerable gains could be made at the chip stack level, and even more at the CMOS level, he said. Coupled with low-power design, 3-D integration could offer a potential solution for system performance.
Plan C — options beyond CMOS — include such things as photonics, spintronics, quantum computing, and atomic/molecular configurations. Where IBM is investing a lot of time and money, Chen said, is with carbon nanotubes. "We think this is the most realistic alternative to a charge-transport-based system," he said. "We don't want to totally disrupt the existing infrastructure, and we think the carbon nanotube is the closest in that respect." Although spintronics is very promising, he added, that infrastructure would require a considerable change from what the industry is doing today.
Source:
reed-electronics.com
Bookmark:
| Related News Press |
Spintronics
Quantum materials: Electron spin measured for the first time June 9th, 2023
Spin photonics to move forward with new anapole probe November 4th, 2022
Chip Technology
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
New discovery aims to improve the design of microelectronic devices September 13th, 2024
Groundbreaking precision in single-molecule optoelectronics August 16th, 2024
Nanotubes/Buckyballs/Fullerenes/Nanorods/Nanostrings
Tests find no free-standing nanotubes released from tire tread wear September 8th, 2023
Detection of bacteria and viruses with fluorescent nanotubes July 21st, 2023
Nanoelectronics
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022
Reduced power consumption in semiconductor devices September 23rd, 2022
Atomic level deposition to extend Moore’s law and beyond July 15th, 2022
Interviews/Book Reviews/Essays/Reports/Podcasts/Journals/White papers/Posters
Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024
Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||