Home > Press > CEA-Leti to Present 21 Papers at Photonics West & Unveil its Latest Research on Greater Photonics-Electronics and Software Convergence: Optics and Si-Photonics Teams Will Explain Transfer-Ready Solutions For Wavelength Imaging and Other Applications at Leti Booth, Feb. 5-7
Abstract:
Leti, an institute of CEA-Tech, will present eight invited papers, 21 in total, at Photonics West 2019 in San Francisco, and unveil its latest research on improved photonics-electronics and software convergence at a Feb. 6 workshop.
From Feb. 5-7 in booth #959B, CEA-Leti’s multidisciplinary optics-and-photonics teams will introduce their latest ready-to-be-transferred solutions for all-wavelength imaging – visible, infrared, THz – as well as information displays, solid-state lighting, optical data communications, optical sensors, and more.
For the fourth consecutive year, Leti will host a photonics workshop and networking-cocktail reception for invited guests during Photonics West. Beginning at 5:30 pm, Feb. 6 in the W-Hotel, Leti will unveil its latest research towards greater photonics-electronics and software convergence.
Workshop Topics
· Introduction – Ludovic Poupinet, Head of CEA-Leti’s Optics & Photonics Division
· Next Generation Disruptive Adaptive Driving Headlight Technology –
Jy Bhardwaj, Chief Technology Officer, Lumileds
· Smart Retina for Edge Intelligence – Marc Duranton, CEA Fellow, CEA-Leti’s Architecture, IC Design & Embedded Software Division
· Towards Smart Miniaturized LIDAR – Eleonore Hardy, CEA-Leti
Business Developer, Silicon Photonics
· On-Chip Optical Sensing for Chemical Trace Detection – Sergio Nicoletti, CEA-Leti Business Developer, Optical Sensors
· A Solution Towards Large-Area MicroLED Displays – François Templie, CEA-Leti Strategic Marketing Manager for Displays
· Curved Image Sensor: A Minor Change for Great Benefits – Alexis Rochas, CEA-Leti Business Developer, Visible Imaging
Photonics West Papers
Saturday, Feb 2
· Fibre grating coupler development for Si-photonics process design kits at CEA-Leti (Invited) 9:20 am ROOM 152 (SOUTH UPPER MEZZANINE)
· Time-resolved optical monitoring to detect and identify deep flaps (Invited) 10:30 am ROOM 54 (SOUTH LOWER MEZZANINE)
· Surprisingly simple and compact microscope for time-lapse phase and fluorescence imaging based on chromatic aberration 2:30 pm ROOM 210 (SOUTH LEVEL TWO)
· Quantitative phase imaging of adherent mammalian cells: a comparison of three different techniques 2:50 pm ROOM 210 (SOUTH LEVEL TWO)
Sunday, Feb. 3
· Photoacoustic cell on silicon for mid-infrared QCL-based spectroscopic analysis (Invited) 1:30 pm ROOM 205 (SOUTH LEVEL TWO)
Monday, Feb. 4
· Green InGaN/GaN based LEDs: high luminance and blue shift 8:45 am ROOM 314 (SOUTH LEVEL THREE)
· Statistical study of blood cells population by very wide-field phase/fluorescence imaging 1:20 pm ROOM 159 (SOUTH UPPER MEZZANINE)
· Optical frequency comb generation using annealing-free Si3N4 films for front-end monolithic integration with Si photonics 2:30 pm ROOM 105 (LOBBY LEVEL SOUTH)
· Laser cooling of solids: towards biomedical applications 2:30 pm ROOM 58 (SOUTH LOWER MEZZANINE)
Tuesday, Feb. 5
· Advances on GeSn-based light emitters and photodetectors for mid-IR photonics (Invited) 8:20 am ROOM 152 (SOUTH UPPER MEZZANINE)
· Miniaturization of mid-IR sensors on Si: challenges and perspectives (Invited) 9:00 am ROOM 153 (SOUTH UPPER MEZZANINE)
· Subwavelength cavity optomechanics 11:40 am ROOM 153 (SOUTH UPPER MEZZANINE)
· Advances on large-scale integration CMOS compatible hybrid III-V/Si laser on 200mm platform (Invited) 11:45 am ROOM 152 (SOUTH UPPER MEZZANINE)
· Multiplexed pixelated hologram recording process for retinal projection device 1:40 pm ROOM 72 (SOUTH LOWER MEZZANINE)
· InGaN/GaN μLED SPICE modelling with size-dependent ABC model integration 2:50 pm ROOM 311 (SOUTH LEVEL THREE)
Wednesday, Feb. 6
· Technological advances on Si and Si3N4 low-loss waveguide platforms for nonlinear and quantum optics applications 8:30 am ROOM 213 (SOUTH LEVEL TWO)
· Integrated optical network design for a retinal projection concept based on single-mode SiN waveguides at 532 nm 8:40 am ROOM 105 (LOBBY LEVEL SOUTH)
· Atomic-scale engineering of amorphous Ge-Sb-S-Se-Te chalcogenide thin films for nonlinear optics in the mid-infrared 10:30 am ROOM 105 (LOBBY LEVEL SOUTH)
· Single-mode lasing in strained Ge microbridges (Invited) 10:30 am ROOM 153 (SOUTH UPPER MEZZANINE)
Thursday, Feb. 7
· Development of a 360° display based on transparent projection surface: application to a theatrical performance 9:00 am ROOM 151 (SOUTH UPPER MEZZANINE)
· Advanced solutions for high-performance GaN MicroLED displays (Invited) 9:30 am ROOM 314 (SOUTH LEVEL THREE)
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About Leti
Leti, a technology research institute at CEA Tech, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare; Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 1,900, a portfolio of 2,700 patents, 91,500 sq. ft. of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo. CEA-Leti has launched 60 startups and is a member of the Carnot Institutes network. This year, the institute celebrates its 50th anniversary. Follow us on www.leti-cea.com and @CEA_Leti.
CEA Tech is the technology research branch of the French Alternative Energies and Atomic Energy Commission (CEA), a key player in innovative R&D, defence & security, nuclear energy, technological research for industry and fundamental science, identified by Thomson Reuters as the second most innovative research organization in the world. CEA Tech leverages a unique innovation-driven culture and unrivalled expertise to develop and disseminate new technologies for industry, helping to create high-end products and provide a competitive edge.
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