Nanotechnology Now - Press Release: More 22 of 59,885 Print all In new window Leti to Present Update of CoolCube/3DVLSI Technologies Development at 2017 IEEE S3S: Future Developments and Tape-Out Vehicles to Be Presented during Oct. 17 Workshop

Home > Press > More 22 of 59,885 Print all In new window Leti to Present Update of CoolCube/3DVLSI Technologies Development at 2017 IEEE S3S: Future Developments and Tape-Out Vehicles to Be Presented during Oct. 17 Workshop

Abstract:
Leti, a research institute of CEA Tech, will hold a workshop on Oct. 17 to present updates on their progress developing CoolCubeTM high-density 3D sequential, monolithic-integration technology, and their supporting design-and-manufacturing ecosystems.

More 22 of 59,885 Print all In new window Leti to Present Update of CoolCube/3DVLSI Technologies Development at 2017 IEEE S3S: Future Developments and Tape-Out Vehicles to Be Presented during Oct. 17 Workshop

Grenoble, France | Posted on October 12th, 2017

The workshop at the Hyatt Regency San Francisco Airport, Burlingame, Calif., is an official satellite event of the 2017 IEEE S3S conference. It will feature presentations from Leti and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, as well as partner firms, such as Applied Materials, SCREEN Semiconductor and HP Enterprise. Workshop attendees will include representatives of a growing ecosystem of design, manufacturing, and related companies.

As an extension of High Density 3D Cu-Cu/Hybrid Bonding Chip-to-Wafer/Wafer-to-Wafer Technologies, the CoolCubeTM concept enables stacking active layers of transistors in the third dimension, while coping with thermal budgets that do not degrade the performance of transistors or metal interconnects. Leti and Qualcomm have been collaborating for four years on various 3DVLSI advanced concepts, which have broad applications in low-power mobile devices and other IC platforms.

Workshop topics will include:
a review of 3DVLSI research at Qualcomm Technologies
an update on Leti’s technology and design
a complete Leti 3D-technologies landscape presentation, and
exploration of expectations and challenges around 3DVLSI technology.

The workshop is designed to encourage an active exchange of ideas among attendees on applications, markets, integration and other related areas.

Leti will highlight technological solutions available now for top-tier CMOS integration using CoolCubeTM:
high-quality mono-crystalline channel
high-performance source/drain contacts
high-reliability gate stack and
low-parasitic stable intermediate back-end-of-line on 300mm wafers.

Leti this year taped out a test vehicle based on its internal technology and CoolCubeTM circuit and will publish final results of the test in 2018. In this CMOS integration, the technology starts from 28nm foundry wafers and extends to current Leti top-tier processes. During the Oct. 17 workshop, Leti will present the next step: a new CoolCubeTM tape-out, scheduled for mid-2018 and open to partners and collaborators. It is targeted to demonstrate by hardware promising applications enabled by CoolCube™/3DVLSI. Design contributions are already planned or expected in the following fields: neuromorphic, near-memory processing, high-performance FPGA and energy-efficient computing.

“As CoolCubeTM has evolved, its development team has received a growing number of inquiries from companies and organizations all along the semiconductor value chain, including materials and equipment suppliers, electronic design automation (EDA) companies, fabless chipmakers and foundries, and assembly and test houses,” said Jean-Eric Michallet, Leti Head of Microelectronics Components Department. “Mutual cooperation will be an essential element of successful integration into high-volume production, and representatives of companies in these sectors are encouraged to attend the workshop.”

Oct. 17 CoolCube/3DVLSI Workshop: Registration is open, free and available to S3S attendees. Attendance is limited to registered guests. Contact

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About Leti
Leti, a technology research institute at CEA Tech, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, Leti pioneers micro- & nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 1,900, a portfolio of 2,700 patents, 91,500 sq. ft. of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo. Leti has launched 60 startups and is a member of the Carnot Institutes network. Follow us on www.leti.fr/en and @CEA_Leti.
CEA Tech is the technology research branch of the French Alternative Energies and Atomic Energy Commission (CEA), a key player in innovative R&D, defense & security, nuclear energy, technological research for industry and fundamental science. In 2015, Thomson Reuters identified CEA as the most innovative research organization in the world.

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