Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX™ Solutions: Increased support affirms FDXcelerator™ Program’s vital role in promoting broader deployment of GLOBALFOUNDRIES’ FDX™ portfolio

Abstract:
GLOBALFOUNDRIES today announced the addition of eight new partners to its growing FDXcelerator Program, including Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Rambus, Sasken, Sonics, and QuickLogic. These new partners join Synopsys, Cadence, INVECAS, VeriSilicon, CEA Leti, Dreamchip, and Encore Semi to provide a suite of services that will enable GLOBALFOUNDRIES customers to rapidly implement 22FDX® system-on-chip (SoC) designs in low-power applications spanning Internet-of-Things (IoT), mobile, RF connectivity, and networking markets.

GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX™ Solutions: Increased support affirms FDXcelerator™ Program’s vital role in promoting broader deployment of GLOBALFOUNDRIES’ FDX™ portfolio

Santa Clara, CA | Posted on December 15th, 2016

The FDXcelerator Partner Program builds upon GLOBALFOUNDRIES’ 22FDX and 12FDX™ technologies, an alternative to FinFET-based technologies for chips that require performance on demand and energy efficiency at the lowest solution cost. GLOBALFOUNDRIES' 22FDX platform provides a lower-cost migration path from bulk nodes such as 40nm and 28nm, which allows customers to design differentiated, intelligent, and fully-integrated system solutions.

FDXcelerator partners play a critical role by providing a set of specific solutions and resources that help increase design productivity on FDX technology and reduce time-to-market for its customers. GLOBALFOUNDRIES works closely with program partners to help customers create high-performance 22FDX designs while minimizing development costs through access to a broad set of quality offerings, specific to 22FDX technology. The partner ecosystem allows GLOBALFOUNDRIES to accelerate its traction in the market and more effectively offer its FDX products and services to a broader range of customers.

The partner program extends the reach of the FD-SOI ecosystem, creating an open framework that allows selected partners to integrate their products or services into a validated, plug-and-play catalog of design solutions. The program encompasses FDX-tailored solutions and services, including:
EDA tools that leverage differentiated FD-SOI body-bias features, built into industry-leading design flows;
IP design elements and complete libraries, including foundational IP, interfaces and complex IP to enable foundry customers to start designs quickly with validated IP elements;
ASIC platforms for a complete 22FDX ASIC offering;
Reference solutions and system-level expertise in emerging application areas to speed time-to-market;
Outsourced assembly and test (OSAT) solution featuring extensive manufacturing capacity to enable state-of-the art SoC delivery, and;
Design consultation and other services dedicated to FDX technology.
“As the FDXcelerator program continues to expand, partners play a critical role in helping to serve our growing number of customers and extend the reach of our FD-SOI ecosystem by providing innovative FDX-tailored solutions and services,” said Alain Mutricy, senior vice president of product management at GLOBALFOUNDRIES. “These new partners will help drive deeper engagement and enhance technology collaboration, including tighter interlock around quality, qualification and development methodology, enabling us to deliver advanced 22FDX SoC solutions.”

GLOBALFOUNDRIES is focused on building strong ecosystem partnerships with industry leaders. With the FDXcelerator program, GLOBALFOUNDRIES’ partners and customers can now benefit from a greater availability of resources to take advantage of the broad adoption and accelerating growth of the FDX market.

To learn more about GLOBALFOUNDRIES’ FDXcelerator partner program, please visit our Partners page.
Supporting Quotes

"With a fast-evolving IoT and wearables application landscape, ASE is pleased to have been selected by GLOBALFOUNDRIES as a trusted partner to provide a robust and reliable supply chain for IC assembly and test services, ultimately accelerating time-to-market for our mutual customers. Through this collaboration, ASE has successfully qualified GLOBALFOUNDRIES’ FDX technology platform using our innovative wire bond, flip chip and wafer level packaging technologies. Going forward, we are excited to further expand our partnership with GLOBALFOUNDRIES so customers can increasingly draw from our complementary portfolios encompassing foundry and packaging & test capabilities, all of which are being developed to align with emerging market needs."

Rich Rice, Senior Vice President, Business Development, ASE Group

"Amkor Technology is pleased to join GLOBALFOUNDRIES’ FDXcelerator partner program. This ecosystem alliance provides an accelerated time-to-market approach for those customers desiring to benefit from the gains in FD-SOI technology in areas where FinFET struggles with complexity and ability to meet pricing objectives. We look forward to supporting the ecosystem alliance and all of our customers seeking to take advantage of the FDX value proposition."

Ron Huemoeller, Corporate Vice President, WW R&D and Technology Strategy, Amkor Technology

“Infosys helps clients accelerate their time to market with our silicon to systems range of Engineering Services. Being a partner with GLOBALFOUNDRIES FDXcelerator program, further enhances our silicon engineering offerings and puts us in a unique position to address technology requirements for our semiconductor clients.”

Sudip Singh, SVP & Global Head of Engineering Services, Infosys

“Mentor Graphics is pleased to be working with GLOBALFOUNDRIES to provide the industry with more process options for chip design. Mentor’s support for the FDXcelerator program includes not only the Calibre® platform, but also participation from our Digital IC Design product offerings, the Analog FastSPICE (AFS)™ and Eldo® analog/mixed-signal platforms, and the Tessent® test suite. The result is a Mentor offering that allows mutual customers to fully leverage the unique capabilities of GLOBALFOUNDRIES FDX processes, and move from design to silicon with confidence.”

Joe Sawicki, Vice President and General Manager of the Design-to-Silicon Division at Mentor Graphics

“We are pleased to be part of the FDXcelerator program and to broaden our collaboration with GLOBALFOUNDRIES. Through our participation in this program, our DPA-resistant security cores will be made available as part of the pre-validated ecosystem of 22FDX™ IP. This program helps extend the reach of our best-in-class security cores and accelerates the time-to-market for our customers.”

Dr. Martin Scott, General Manager of the Rambus Security Division

“Sasken has a deep understanding of the software solutions and processes needed to help OEMs keep pace with the evolution of IoT, automotive, industrial and emerging devices technology. With the increasing demand for custom and bespoke system-on-chip (SoC) solutions, reference designs and newer devices, the FDXcelerator program will enable rapid SoC production and speed up time-to-market. Sasken’s excellence in complete product realization, which includes software and hardware, along with GLOBALFOUNDRIES’ FDXcelerator Partnership Program will enable custom design solutions at a faster pace.”

Rajiv Mody, Chairman, Managing Director, and CEO, Sasken Communication Technologies Ltd.

“Sonics is partnering with GLOBALFOUNDRIES FDXcelerator program because we share a commitment to lowering energy consumption and increasing performance for our SoC design customers. Sonics’ leadership in network-on-chip (NoC) technologies has made it the industry’s most trusted solution provider for on-chip communications. Now, our new energy processing unit (EPU) technology provides innovative on-chip energy management capabilities at the architecture level where the greatest potential for power savings is available. Sonics is excited to bridge application and silicon level power control leveraging the unique advantages of 22FDX.”

Grant Pierce, CEO of Sonics

“We are very excited to launch our ultra-low power ArcticPro™ eFPGA IP solution on GLOBALFOUNDRIES’ cost- and power-optimized 22 FDX process. This partnership leverages our nearly three decades of FPGA experience to provide GLOBALFOUNDRIES customers with a proven ultra-low power solution that dramatically increases the flexibility of a SoC design. This increased flexibility can significantly broaden the market for SoC designs and accelerate time to market for both semiconductor companies and the OEMs that use eFPGA solutions."

Brian Faith, President and CEO of QuickLogic Corporation

####

About GLOBALFOUNDRIES
GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company.

For more information, please click here

Copyright © GLOBALFOUNDRIES

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Hardware

The present and future of computing get a boost from new research July 21st, 2023

A Carbon Nanotube Microprocessor Mature Enough to Say Hello: Three new breakthroughs make commercial nanotube processors possible March 2nd, 2020

Powering the future: Smallest all-digital circuit opens doors to 5 nm next-gen semiconductor February 11th, 2020

SUNY Poly Professor Partners with Leading Institutions on NSF Award for Quantum Information Science Research: SUNY Poly Research Builds Upon Recent Quantum-related Research Initiatives and Workshops January 27th, 2020

Chip Technology

New material to make next generation of electronics faster and more efficient With the increase of new technology and artificial intelligence, the demand for efficient and powerful semiconductors continues to grow November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

New discovery aims to improve the design of microelectronic devices September 13th, 2024

Groundbreaking precision in single-molecule optoelectronics August 16th, 2024

Announcements

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Turning up the signal November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

Alliances/Trade associations/Partnerships/Distributorships

Manchester graphene spin-out signs $1billion game-changing deal to help tackle global sustainability challenges: Landmark deal for the commercialisation of graphene April 14th, 2023

Chicago Quantum Exchange welcomes six new partners highlighting quantum technology solutions, from Chicago and beyond September 23rd, 2022

CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium: Invited paper reports 3-step characterization chain and resulting methodologies and metrics that accelerate learning, provide data on device pe June 17th, 2022

University of Illinois Chicago joins Brookhaven Lab's Quantum Center June 10th, 2022

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project