Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > FEI Enhances DualBeam Productivity, Precision and Ease-of-Use with New Slice & View Software: The ability to obtain faster, easier, better results increases productivity and lowers cost-per-sample

Abstract:
FEI (NASDAQ: FEIC) today announced the release of the latest version of its Auto Slice &View three-dimensional (3D) reconstruction software, which makes 3D imaging faster, easier, more accurate and cost effective. The software works with all of FEI’s current DualBeam focused ion beam (FIB)/scanning electron microscope (SEM) platforms to enable 3D structure and composition of samples at the nanometer scale. DualBeam users across all disciplines, including materials science, life sciences, semiconductor and oil & gas, can benefit from the new, enhanced software.

FEI Enhances DualBeam Productivity, Precision and Ease-of-Use with New Slice & View Software: The ability to obtain faster, easier, better results increases productivity and lowers cost-per-sample

Hillsboro, OR | Posted on June 15th, 2016

“FEI pioneered the development of the DualBeam and its use to reconstruct 3D structures,” said Jean-Bernard Cazeaux, vice president of FEI’s Applications Software Group. “This latest version of our Auto Slice & View software leverages our extensive experience to provide a better tool to enable users to obtain the results they need in a shortened timeframe -- and with limited effort. Ultimately, the results provide a better representation of all the information available from the sample volume and significant improvements in laboratory productivity.”

FEI’s new Slice & View software 4.0 features several enhancements, some of the highlights include:

Productivity – Imaging can be combined with analytical capabilities, such as energy dispersive x-ray spectrometry (EDS) and electron backscatter diffraction (EBSD), to ensure that no information is lost in the sectioning of the sample. Automated procedures can be modified on-the-fly, with the ability to add analytical signals if an unexpected feature is revealed. Imaging and analysis can be dynamically directed to selected areas of the section or applied only on certain slices to save time. Slice & View analyses can be performed at multiple sites to allow long, unattended runs over night or weekends. Advanced tiling and stitching capabilities maintain high spatial resolution over sections larger than a single field of view.

Precision and accuracy – New algorithms help to ensure uniform thickness of the slices and precise and reproducible placement of each cut, allowing for higher accuracy.

Ease of use – A redesigned interface optimizes user guidance and ensures that critical information is presented if needed. A prompted workflow approach streamlines the setup of automated procedures, and any procedure can be tagged as a template to serve as the basis for future analyses.

Current users of version 3.0 can upgrade to the new 4.0 version. For more information about FEI’s Auto Slice & View software, please visit www.fei.com/software/auto-slice-and-view/.

####

About FEI Company
FEI Company (Nasdaq: FEIC) designs, manufactures and supports a broad range of high-performance microscopy workflow solutions that provide images and answers at the micro-, nano- and picometer scales. Its innovation and leadership enable customers in industry and science to increase productivity and make breakthrough discoveries. Headquartered in Hillsboro, Ore., USA, FEI has over 2,800 employees and sales and service operations in more than 50 countries around the world. More information can be found at: www.fei.com.

FEI Safe Harbor Statement

This news release contains forward-looking statements that include statements regarding the performance capabilities and benefits of the Auto Slice & View software. Factors that could affect these forward-looking statements include but are not limited to our ability to manufacture, ship, deliver and install the tools, solutions or software as expected; failure of the product or technology to perform as expected; unexpected technology problems and challenges; changes to the technology; the inability of FEI, its suppliers or project partners to make the technological advances required for the technology to achieve anticipated results; and the inability of the customer to deploy the tools or develop and deploy the expected new applications. Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.

For more information, please click here

Contacts:
Sandy Fewkes (media contact)
MindWrite Communications, Inc.
+1 408 224 4024


FEI
Jason Willey (investors and analysts)
Sr. Director, Investor Relations & Corporate Development
+1 503 726 2533

Copyright © FEI Company

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Imaging

New material to make next generation of electronics faster and more efficient With the increase of new technology and artificial intelligence, the demand for efficient and powerful semiconductors continues to grow November 8th, 2024

News and information

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Software

Visualizing nanoscale structures in real time: Open-source software enables researchers to see materials in 3D while they're still on the electron microscope August 19th, 2022

Luisier wins SNSF Advanced Grant to develop simulation tools for nanoscale devices July 8th, 2022

CEA and Spectronite Develop Software Radio For Spectrally Efficient Backhaul Solutions: Adapted for Spectronite’s X-Series Modem for 5G Systems, the Technology Enables Carrier Aggregation that Provides Radio Links with 10Gb/s Capacity March 4th, 2022

Oxford Instruments’ Atomfab® system is production-qualified at a market-leading GaN power electronics device manufacturer December 17th, 2021

Announcements

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Turning up the signal November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

Tools

New material to make next generation of electronics faster and more efficient With the increase of new technology and artificial intelligence, the demand for efficient and powerful semiconductors continues to grow November 8th, 2024

Turning up the signal November 8th, 2024

Quantum researchers cause controlled ‘wobble’ in the nucleus of a single atom September 13th, 2024

Faster than one pixel at a time – new imaging method for neutral atomic beam microscopes developed by Swansea researchers August 16th, 2024

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project