Home > Press > High-precision positioning of wafers in inspection systems
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Abstract:
The current standard wafer has a diameter of 8". The industry is moving towards manufacturing larger wafers. Technologies for production processes such as stealth dicing, lithography, doping, implanting, planarization makes precise positioning of the bigger substrates a must. Thin film technology places great demands on the substrates and their structures. The piezosystem jena GmbH now offers a positioning system for the inspection of the new larger wafers.
High-precision positioning of wafers in inspection systems
Jena, Germany | Posted on July 8th, 2014The new system offered by piezosystem jena system is designed to position wafers with a diameter up to 12" using precise hold and repeat positioning with the same precise precision. The system can be used as an automated inline controller or as a stand-alone positioner. The highly precise positioning system allows steady processes in production and process control. The new system will also shorten cycle times in quality control. Piezosystem jena's new system offers positioning in microseconds with steps of a few microns with repeatability in nanometers. Your crucial data will be obtained quickly with excellent performance and value.
Requirements:
•measuring range < 300 µm
•small, repeatable steps
•movement free of displacement
•short rise time
•controlled positioning
Applications:
•semi conductor and solar producing
•lithography
•display production
•surface structuring
•surface inspection
•measurement chips
•measurement of conductor tracks
•measurement systems
•quality control
•bonding-technology
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For more information, please click here
Contacts:
Theresa Kuntze
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