Home > News > Kingmax unveils invisible heat sinks
June 9th, 2010
Kingmax unveils invisible heat sinks
Abstract:
Kingmax has announced its latest - and rather bizarre - innovation in memory chips: the invisible heat sink.
The company's latest memory products come with something Kingmax is calling a "Nano Thermal Dissipation Technology" layer - which it claims can "increase the release of radiant heat."
Although the company's press release is a little light on technical details, the technology apparently takes the form of a "nano-size silicon compound [that] fills up the invisible vacant space of the smooth surface to remove the surface heat more quickly[, acting] like a sponge [to] pull the heat and release into the air at a faster rate" than an untreated chip.
Source:
bit-tech.net
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