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Oxford Instruments Plasma Technology (OIPT), leader in systems for etch, deposition and growth, has recently received a multi-system order from the University of Waterloo, Ontario, Canada for installation in their new cleanroom facility.
Canadian research centre orders tools
UK | Posted on May 5th, 2010The process tools ordered are OIPT's System100 ICP & System133 PECVD, and a FlexAL PECVD/ALD Cluster tool, with multi-wafer batch capability and the potential for providing a number of process applications.
OIPT tools offer powerful stand alone and clusterable process modules, enabling a wide range of applications, and the University of Waterloo will be implementing the systems for multiple process techniques. These include Bosch, Cryo silicon etch, Compound Semiconductor, Metal etch, and PECVD. In addition, one of the tools will be clustered to offer ALD process capability, to deposit Al2O3 conformal coating.
The equipment will be housed in the cleanroom at the Mike and Ophelia Lazaridis Quantum-Nano Centre, a new state-of-the-art building now under construction at the heart of the University of Waterloo campus. The facility, slated for completion in 2011, will be shared between the Institute for Quantum Computing and the Waterloo Institute of Nanotechnology.
The purchase of equipment is made possible by the generous support IQC receives from the Canada Foundation for Innovation, the Ontario Research Fund, the University of Waterloo, and the namesakes of the new building, Mike and Ophelia Lazaridis.
Oxford Instruments pursues responsible development and deeper understanding of the world through science and technology, and this order for another new University research facility is testament to that commitment.
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About Oxford Instruments
Oxford Instruments aims to pursue responsible development and deeper understanding of our world through science and technology. We provide high technology tools and systems for industrial and research markets, based on our ability to analyse and manipulate matter at the smallest scale.
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