Home > News > Terepac, IMEC Partner for Low-cost Flexible Electronics
October 22nd, 2009
Terepac, IMEC Partner for Low-cost Flexible Electronics
Abstract:
Terepac Corporation and research center IMEC will collaborate on novel packaging technologies for flexible electronics. The initial driver for this shared research is a next-generation wireless ECG system, developed in the Human++ Program at Holst Centre, Eindhoven.
For many applications, like on-the-body devices, thin and flexible form factors greatly improve the comfort of wearable electronics. To allow large-scale manufacturing and market penetration, low-cost/high-value solutions are targeted in R&D programs. Traditional electronics packaging and assembly with rigid printed circuit boards (PCBs) and pick-and-place machines are unable to cope with these demands, the research partners assert.
Source:
electroiq.com
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