Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > Nextreme Pumps up with New Optocooler High Voltage Series: Thin-Film Thermoelectric Coolers Get Smaller and More Powerful with Technology Advances

Abstract:
Nextreme Thermal Solutions, the leader in microscale thermal and power management products for the electronics industry, today announced the availability of the OptoCooler HV series, a new class of RoHS-compliant high voltage and high heat pumping thermoelectric coolers that are optimized for standard circuitry and power requirements. The first module in the series, the OptoCooler HV14, is the latest product in Nextreme's OptoCooler™ family of thermoelectric coolers designed specifically for the optoelectronics and telecommunications industry.

Nextreme Pumps up with New Optocooler High Voltage Series: Thin-Film Thermoelectric Coolers Get Smaller and More Powerful with Technology Advances

DURHAM, NC | Posted on October 22nd, 2008

The OptoCooler HV14 operates at a maximum voltage of 2.9V and can pump 1.7 watts of heat at 85 °C in a footprint of only 2.8 mm2. The module can create a temperature differential (ΔT) of up to 51 °C between its hot and cold sides, making it ideally suited for the cooling and temperature control of optoelectronic devices such as laser diodes and high brightness LEDs.

At the core of the OptoCooler module is Nextreme's breakthrough Thermal Copper Pillar Bump, an electronic device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular, copper pillar solder bumps) used in electronic and optoelectronic packaging. Thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or other electrical component. Based on market demand and recent technology advances, Nextreme has reduced the size of the thermal bump by 75%, thereby increasing voltages by 300% and reducing current draw by the same proportion. The net result eliminates the need for special voltage conditioning and reduces the overall electrical current required to operate the device.

The new platform uses an array-based assembly (ABA) process that represents a vast improvement in throughput capability and manufacturing tolerances. The ABA process decreases the size of Nextreme's thermal bumps to approximately 125 microns, which makes them flip-chip bumping compatible with standard solder bumping processes commonly used in electronics packaging. Consequently, as product volumes scale, manufacturers of LEDs and other semiconductor chips can integrate cooling and temperature control functionality directly in the package during assembly, resulting in a high-volume, low cost thermal management solution.

"The new HV Series removes unique voltage and current requirements as barriers to the integration of thin-film thermoelectrics into electronics," said Dave Koester, Vice President of Engineering for Nextreme. "The standard voltages and current operating ranges of the new OptoCooler HV14 fit well within the typical power design criteria for optoelectronic components and systems."

The OptoCooler HV14 is RoHS compliant and is available for order now. Pricing is available upon request.

More information on the OptoCooler HV14 can be found at www.nextreme.com/optocooler. Contact Nextreme at 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031; call (919)-597-7300; e-mail ; or go to www.nextreme.com.

####

About Nextreme Thermal Solutions™, Inc.
Nextreme Thermal Solutions designs and manufactures microscale thermal and power management products for the electronics, telecommunications, semiconductor, consumer, and defense/aerospace industries. The company uses breakthrough thin-film thermoelectric material to embed cooling, temperature control and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging. Nextreme's headquarters and manufacturing facility are based near Research Triangle Park, North Carolina.

For additional information or to request the electronic image, please email or call 919-872-8172.

For more information, please click here

Contacts:
Nextreme Thermal Solutions, Inc.
Karl von Gunten
919-597-7348

or
BtB Marketing Communications
Beth Gaddy
919-872-8172

Copyright © Business Wire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

INRS and ELI deepen strategic partnership to train the next generation in laser science:PhD students will benefit from international mobility and privileged access to cutting-edge infrastructure June 6th, 2025

Electrifying results shed light on graphene foam as a potential material for lab grown cartilage June 6th, 2025

Quantum computers simulate fundamental physics: shedding light on the building blocks of nature June 6th, 2025

A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025

Chip Technology

A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025

Programmable electron-induced color router array May 14th, 2025

Enhancing power factor of p- and n-type single-walled carbon nanotubes April 25th, 2025

Ultrafast plasmon-enhanced magnetic bit switching at the nanoscale April 25th, 2025

Optical computing/Photonic computing

Programmable electron-induced color router array May 14th, 2025

Nanophotonic platform boosts efficiency of nonlinear-optical quantum teleportation April 25th, 2025

Groundbreaking research unveils unified theory for optical singularities in photonic microstructures December 13th, 2024

UCF researcher discovers new technique for infrared “color” detection and imaging: The new specialized tunable detection and imaging technique for infrared photons surpasses present technology and may be a cost-effective method of capturing thermal imaging or night vision, medica December 13th, 2024

Announcements

INRS and ELI deepen strategic partnership to train the next generation in laser science:PhD students will benefit from international mobility and privileged access to cutting-edge infrastructure June 6th, 2025

Electrifying results shed light on graphene foam as a potential material for lab grown cartilage June 6th, 2025

Quantum computers simulate fundamental physics: shedding light on the building blocks of nature June 6th, 2025

A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project