Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > Making a Good Impression: Nanoimprint Lithography Tests at NIST

Electron micrograph shows a cross-section of a typical SOG microcircuit feature. Nanoporous regions in the interior are lighter. The process forms a dense, stronger skin about 2 nanometers thick on the outside. (Color added for clarity.)

Credit: NIST
Electron micrograph shows a cross-section of a typical SOG microcircuit feature. Nanoporous regions in the interior are lighter. The process forms a dense, stronger skin about 2 nanometers thick on the outside. (Color added for clarity.)

Credit: NIST

Abstract:
In what should be good news for integrated circuit manufacturers, recent studies by the National Institute of Standards and Technology (NIST) have helped resolve two important questions about an emerging microcircuit manufacturing technology called nanoimprint lithography—yes, it can accurately stamp delicate insulating structures on advanced microchips, and, no, it doesn't damage them, in fact it makes them better.

Making a Good Impression: Nanoimprint Lithography Tests at NIST

GAITHERSBURG, MD | Posted on April 29th, 2008

An emerging manufacturing technique, nanoimprint lithography (NIL) is basically an embossing process. A stamp with a nanoscale pattern in its surface is pressed into a soft film on the surface of a semiconductor wafer. The film is hardened, usually by heating or exposure to ultraviolet light, and the film retains the impressed pattern from the stamp. The process is astonishingly accurate. NIL has been used to create features as small as ten nanometers across with relatively complex shapes.

NIL is being eyed in particular for building the complexly patterned insulating layers sandwiched between layers of logic devices in future generations of integrated circuits. State-of-the-art semiconductors contain over a billion transistors, packed together into a footprint of silicon that is no bigger than a few square centimeters. Several miles of nanoscale copper wiring are required to connect the devices, and these wires must be separated by a highly efficient insulator. One candidate is a porous glassy material called SOG* that can be applied as a thin fluid film. When heated, SOG turns into a thin glass film laced with nanometer pores that enhance the electrical insulation. But SOG is relatively delicate, and the conventional photoresist etching process used to cut trenches for the wiring can compromise it. NIL, on the other hand, might be able to pattern SOG layers with wiring trenches and eliminate several time-consuming and expensive photolithography steps if it could pattern the film accurately and do so without destroying the delicate nanopore lacework.

In a paper published last fall,** NIST materials scientists addressed the first question. Using sensitive X-ray measurements they demonstrated that NIL could be used on a functional SOG material to transfer patterns with details finer than 100 nanometers with minimal distortion due to the processing. In a new paper this month,*** they extend this work to study the effect of the embossing process on the nanopore structure in the glass. Using a combination of techniques to measure the distribution of nanopores in the insulator material, they found that the NIL embossing process actually has a beneficial effect—it increases the population of small pores, which improve performance, reduces the population of larger pores that can cause problems and creates a thin, dense protective skin across the surface of the material. All of these effects are highly attractive for minimizing short circuits in semiconductor devices.

Taken together, the two papers suggest that nanoimprint lithography can produce superior nanoporous insulator layers in advanced semiconductor devices with significantly fewer—and easier—processing steps than conventional lithography.

* "Spin-on organosilicate glass"

** H.W. Ro, R.L. Jones, H. Peng, D.R. Hines, H-J. Lee, E.K. Lin, A. Karim, D.Y. Yoon, D.W. Gidley and C.L. Soles. The direct patterning of nanoporous interlayer dielectric insulator films by nanoimprint lithography. Advanced Materials. 2007, 19, 2919-2924.

*** H.W. Ro, H. Peng, K.-i. Niihara, H.-J. Lee, E.K. Lin, A. Karim, D.W. Gidley, H. Jinnai, D.Y. Yoon and C.L. Soles. Self-sealing of nanoporous low dielectric constant patterns fabricated by nanoimprint lithography. Advanced Materials 2008, Early View: April 15, 2008.

####

About NIST
From automated teller machines and atomic clocks to mammograms and semiconductors, innumerable products and services rely in some way on technology, measurement, and standards provided by the National Institute of Standards and Technology.

Founded in 1901, NIST is a non-regulatory federal agency within the U.S. Department of Commerce. NIST's mission is to promote U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life.

For more information, please click here

Contacts:
Michael Baum

(301) 975-2763

Copyright © NIST

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Chip Technology

New material to make next generation of electronics faster and more efficient With the increase of new technology and artificial intelligence, the demand for efficient and powerful semiconductors continues to grow November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

New discovery aims to improve the design of microelectronic devices September 13th, 2024

Groundbreaking precision in single-molecule optoelectronics August 16th, 2024

Discoveries

Breaking carbon–hydrogen bonds to make complex molecules November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Turning up the signal November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

Announcements

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Turning up the signal November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

Printing/Lithography/Inkjet/Inks/Bio-printing/Dyes

Presenting: Ultrasound-based printing of 3D materials—potentially inside the body December 8th, 2023

Simple ballpoint pen can write custom LEDs August 11th, 2023

Disposable electronics on a simple sheet of paper October 7th, 2022

Newly developed technique to improve quantum dots color conversion performance: Researchers created perovskite quantum dot microarrays to achieve better results in full-color light-emitting devices and expand potential applications June 10th, 2022

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project