Home > News > Fifth International Wafer-Level Packaging Conference Set for Oct. 13-16
January 5th, 2008
Fifth International Wafer-Level Packaging Conference Set for Oct. 13-16
Abstract:
The fifth annual International Wafer-Level Packaging Conference and Tabletop Exhibition will expand to four days in 2008, beginning on October 13 and ending on October 16 at the Wyndham Hotel.
The workshop program is now being created and will include half-day workshops by experts that include Dr. Ken Gilleo, renowned inventor, international lecturer, and author of seven McGraw-Hill books on semiconductors, MEMS and nanotechnology trends and packaging. Dr. Gilleo will present two workshops that feature MEMS and nanotechnology.
Source:
pcb007.com
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