Home > News > Metal Powders May Hold Promise for Lead Free Solder, Adhesive
February 9th, 2006
Metal Powders May Hold Promise for Lead Free Solder, Adhesive
Abstract:
It's not a particularly large area of research, at least not yet. But there are several R&D institutions, industry groups and startups in the industry looking at how nanomaterials can help bring about the lead-free packaging era, such as the Georgia Institute of Technology, the International Electronics Manufacturing Initiative (iNEMI) or NanoDynamics Inc., a Buffalo, N.Y.-based startup.
The potential use of nanomaterials in lead-free packaging is not really much different from their applications in other fields, noted Lubab Sheet, senior director of nanotechnology at Semiconductor Equipment and Materials International (SEMI). It is a matter of controlling the materials at a molecular and atomic level to achieve intended results.
Source:
reed-electronics.com
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