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May 19th, 2005

Nanotubes cut copper creep

Abstract:
Electromigration is becoming a significant problem in ICs, especially as current densities increase, but a team of Japanese scientists claims that carbon nanotubes could help.

The team from Fujitsu has used carbon nanotubes to produce vias linking metal layers inside an IC. This capability was discussed at the Japan Nano Tech 2005 conference earlier this year.

Source:
reed-electronics.com

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