Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > News > Fujitsu finds copper-bottomed solution to chip problem

March 1st, 2005

Fujitsu finds copper-bottomed solution to chip problem

Abstract:
Fujitsu claims to have answered a major technological problem of the future for chip makers by using carbon nanotubes to replace copper wires in circuits.

Chips to be made around 2010 will have connecting wires made of copper that will be so thin that electrons will tend to migrate and leak out of the wires, said Yuji Awano, a research fellow at Fujitsu Laboratories' Nanotechnology Research Center.

Source:
techworld.com

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related Links

Fujitsu

Related News Press

Chip Technology

Development of 'transparent stretchable substrate' without image distortion could revolutionize next-generation displays Overcoming: Poisson's ratio enables fully transparent, distortion-free, non-deformable display substrates February 28th, 2025

New ocelot chip makes strides in quantum computing: Based on "cat qubits," the technology provides a new way to reduce quantum errors February 28th, 2025

Enhancing transverse thermoelectric conversion performance in magnetic materials with tilted structural design: A new approach to developing practical thermoelectric technologies December 13th, 2024

Bringing the power of tabletop precision lasers for quantum science to the chip scale December 13th, 2024

Nanotubes/Buckyballs/Fullerenes/Nanorods/Nanostrings

Chainmail-like material could be the future of armor: First 2D mechanically interlocked polymer exhibits exceptional flexibility and strength January 17th, 2025

Innovative biomimetic superhydrophobic coating combines repair and buffering properties for superior anti-erosion December 13th, 2024

Catalytic combo converts CO2 to solid carbon nanofibers: Tandem electrocatalytic-thermocatalytic conversion could help offset emissions of potent greenhouse gas by locking carbon away in a useful material January 12th, 2024

TU Delft researchers discover new ultra strong material for microchip sensors: A material that doesn't just rival the strength of diamonds and graphene, but boasts a yield strength 10 times greater than Kevlar, renowned for its use in bulletproof vests November 3rd, 2023

Nanoelectronics

Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023

Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022

Reduced power consumption in semiconductor devices September 23rd, 2022

Atomic level deposition to extend Moore’s law and beyond July 15th, 2022

Announcements

Development of 'transparent stretchable substrate' without image distortion could revolutionize next-generation displays Overcoming: Poisson's ratio enables fully transparent, distortion-free, non-deformable display substrates February 28th, 2025

Unraveling the origin of extremely bright quantum emitters: Researchers from Osaka University have discovered the fundamental properties of single-photon emitters at an oxide/semiconductor interface, which could be crucial for scalable quantum technology February 28th, 2025

Closing the gaps — MXene-coating filters can enhance performance and reusability February 28th, 2025

Rice researchers harness gravity to create low-cost device for rapid cell analysis February 28th, 2025

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books



NNN
The Hunger Project