Nanotechnology Now - Press Release: Semblant to Present at China Mobile Manufacturing Forum 2016

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Abstract:
Semblant, the market leader in protective nanocoatings and liquid damage protection for electronic devices, today announced that Abe Ghanbari, Chief Solutions Officer, will present at China Mobile Manufacturing Technology Forum (CMMF) 2016 on Thursday, Aug. 25 from 3:00 - 3:30 p.m. Ghanbari will present on the topic of mobile device water/life-proofing, focusing on the importance of green solutions that go beyond making a device waterproof, that are also resistant to the corrosive elements found in sweat, dust, rain, coffee, champagne, and more. It's not enough for today's devices to be waterproof; they must also be life-proof and use environmentally friendly approaches.

Semblant to Present at China Mobile Manufacturing Forum 2016

Scotts Valley, CA | Posted on August 25th, 2016

CMMF is the only high-end technology conference in China that focuses on mobile terminal manufacturing technologies. Covering topics ranging from micro-component assembly and quality management to today's 3D implementations, FPC, DFX as well as manufacturing enterprise management and executive systems, CMMF has witnessed, and even led, multiple innovations in China's mobile manufacturing technology. Ghanbari will present during the Waterproofing Technology session, which takes place in 6/F Narcissus Hall.

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About Semblant
Semblant is the global leader in innovating and deploying protective nanomaterials in the electronics industry. The company's unique Nano-Shield™ nanotechnology solutions, backed by a broad range of fundamental patents, have been designed specifically to protect electronic devices from liquid ingress, corrosion and many other forms of damage. This saves the industry billions of dollars each year in return and repair costs. Semblant's nanocoatings are also environmentally friendly and release no hazardous materials in the manufacturing process. The company provides solutions to the mobile phone, wearable, enterprise computing, network infrastructure, medical device, automotive and space/military/aerospace markets, as well as the printed circuit board and semiconductor/semiconductor packaging industries.

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Contacts:
Henri Vies

T: 650-776-9289

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