Home > Press > Application of Tin Nanostructures in Wastewater Treatment, Production of Nanocomposites
Abstract:
Iranian researchers from Kashan University produced appropriate catalytic structures to treat plant wastewater by using tin oxide nanostructures smaller than 20 nm.
Among other advantages of the structure, mention can be made of its application in the production of a type of polymeric nanocomposite and a type of fireproof nanocomposite, which has applications in various industries, including textile, aerospace and electronics.
The research has been carried out at laboratorial scale. The catalytic performance of the product has been studied in the degradation of a few types of various dyes and in the purification of the materials contaminated by dyes.
Based on the results, the nanocatalyst has very appropriate efficiency in the shortest possible time in comparison with other nanocatalysts existing in the market. Therefore, the proposed nanostructure can be considered as a good replacement for the expensive and rare nanocatalysts and it can be used in almost all industries that require water recycling due to its catalytic activity and simple and cost-effective production method.
According to the researchers, the produced nanostructures can be used in the production of PVA polymeric nanocomposites as fillers. Results obtained from analysis of the nanocomposite showed that the addition of nanoparticles reduces the choking time of fire and slows down the flammability of the final nanocomposite.
Taking into consideration the changes in the properties, the nanocomposite can be used in various industries such as textile (production of fireproof fabrics), aerospace, fireproof nanocoatings, plastic insulation of wires and cables in electronics and many other industries that require thermal stability in devices and tools. Therefore, the nanocomposite can be considered as a good replacement for the existing toxic halogen fillers without creation of any toxic or harmful effects.
Results of the research have been published in Journal of Materials Science: Materials in Electronics, vol. 26, issue 8, 2015, pp. 6075-6085.
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