Nanotechnology Now

Our NanoNews Digest Sponsors
Heifer International



Home > Press > Leti Will Present 17 Papers at 2014 IEDM; the Highest-ever Total Includes Four Invited Papers: Institute also Will Present its Latest Results in Key Technologies and Its Roadmap for Silicon Nano-technologies at Workshop

Abstract:
CEA-Leti will present 17 papers at the 2014 IEEE International Electron Devices Meeting (IEDM) Dec. 15-17 in San Francisco, Calif. The total is the most ever for Leti and it includes four invited papers.

Leti Will Present 17 Papers at 2014 IEDM; the Highest-ever Total Includes Four Invited Papers: Institute also Will Present its Latest Results in Key Technologies and Its Roadmap for Silicon Nano-technologies at Workshop

Grenoble, France | Posted on November 13th, 2014

Leti also will host a Dec. 14 workshop for invited guests to present its latest high-level results in key technologies and its roadmap for silicon nanotechnologies in the next 10 years. Discussions, networking and cocktails will follow these presentations.

The devices workshop from will include summaries of:

· Leti's innovative route with industry

· Emerging material for future market opportunities

· Leti's vision towards 10nm and below

· CoolCubeTM, a powerful approach for further 3D VLSI scaling

· Embedded NVM for the future

· Going further with disruptive designs and architectures

· Electronic medicine: a new market needing new medical methodologies

####

About CEA-Leti
By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Visit www.leti.fr for more information. Follow us on www.leti.fr and @CEA_Leti.

For more information, please click here

Contacts:
CEA-Leti
+33 4 38 78 02 26


Agency
+33 6 74 93 23 47

Copyright © CEA-Leti

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related Links

See PDF for paper abstracts, presenters and other details:

Related News Press

News and information

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Nanoelectronics

Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023

Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022

Reduced power consumption in semiconductor devices September 23rd, 2022

Atomic level deposition to extend Moore’s law and beyond July 15th, 2022

Announcements

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Turning up the signal November 8th, 2024

Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024

Interviews/Book Reviews/Essays/Reports/Podcasts/Journals/White papers/Posters

Beyond wires: Bubble technology powers next-generation electronics:New laser-based bubble printing technique creates ultra-flexible liquid metal circuits November 8th, 2024

Nanoparticle bursts over the Amazon rainforest: Rainfall induces bursts of natural nanoparticles that can form clouds and further precipitation over the Amazon rainforest November 8th, 2024

Nanotechnology: Flexible biosensors with modular design November 8th, 2024

Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024

Events/Classes

A New Blue: Mysterious origin of the ribbontail ray’s electric blue spots revealed July 5th, 2024

Researchers demonstrate co-propagation of quantum and classical signals: Study shows that quantum encryption can be implemented in existing fiber networks January 20th, 2023

CEA & Partners Present ‘Powerful Step Towards Industrialization’ Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium: Invited paper reports 3-step characterization chain and resulting methodologies and metrics that accelerate learning, provide data on device pe June 17th, 2022

June Conference in Grenoble, France, to Explore Pathways to 6G Applications, Including ‘Internet of Senses’, Sustainability, Extended Reality & Digital Twin of Physical World: Organized by CEA-Leti, the Joint EuCNC and 6G Summit Sees Telecom Sector as an ‘Enabler for a Sustainabl June 1st, 2022

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project