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Abstract:
Recognized ESH leaders to discuss future visions, current concerns at leading conference for manufacturers

ISMI Symposium Brings Together Expert Panel to Discuss Environment, Safety, and Health Challenges for Next Gen Fabs

Austin, TX | Posted on September 22nd, 2009

The 6th Annual ISMI Symposium on Manufacturing Effectiveness is featuring a panel of environment, safety, and health experts during its annual conference being held at the Hilton Austin Airport on October 19-22, 2009. The panel discussion, entitled "ESH Challenges for the Next Generation Fabs," will provide attendees with forward-looking ideas on leading-edge technologies that protect the environment, as well as more effective processes for lowering the costs of chip manufacturing.

"As semiconductor processes and products become increasingly complex, so do EHS challenges," said Tim Higgs, environmental engineer at Intel. "Larger fabs with greater resource demands, the use of exotic materials, and increasingly more complex regulatory constraints are some of the key challenges that drive the need for EHS professionals to continuously share information and advance their skills."

The panel will be held during the "ESH Solutions" session on Wednesday, October 21, at 2:45 p.m. Panelists will present a short overview of their perspective on key ESH challenges for the next generation of fabs.

The expert panelists include:

· Arthur Chuang, Director of New Fab Planning & Engineering Division, TSMC
· Tim Higgs, Environmental Engineer, Intel
· Bruce Klafter, Director, Global EHS, Applied Materials
· Aaron Zude, Senior EHS Director, SEMI

"Recently there has been a heightened focus on using ‘green' building and manufacturing to both minimize environmental impact and improve efficiency," said James Beasley, session chair and ESH project manager at ISMI. "The key is very early engagement with universities and consortia, and across the supply chain, to assess new materials, develop optimum material handling procedures, and find new ways to conserve resources."

ISMI's Manufacturing Week will bring together industry leaders, experts, fab engineers, and managers to facilitate knowledge exchange and tackle the toughest productivity challenges in the industry.

The event program includes two days of pre-symposium workshops and short courses, followed by a multi-track symposium on fab and equipment productivity, green manufacturing, statistical methods, yield metrology, concepts in manufacturing, and e-manufacturing, accompanied by an exhibitors' pavilion filled with the latest tools and solutions from some of the industry's top suppliers.

To register for this event or for general information about ISMI's Manufacturing Week, visit www.ismi.sematech.org/ismisymposium.

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About ISMI
ISMI is a global alliance of the world’s major semiconductor manufacturers, dedicated to reducing cost per wafer and ultimately cost per die, through cooperative programs focused on manufacturing effectiveness. ISMI is a wholly-owned subsidiary of SEMATECH (www.sematech.org).

About Manufacturing Week

Manufacturing Week is an annual conference designed to accelerate collaboration and problem solving in the chip manufacturing community by bringing key stakeholders together to share information and methodologies for increasing productivity and reducing manufacturing expenses through advances in equipment, processes, resources, fab design, and manufacturing methods. For more information visit: www.ismi.sematech.org/ismisymposium.

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Contacts:
Erica McGill
SEMATECH Media Relations
257 Fuller Road, Suite 2200, Albany, NY, 12203
o: 518-649-1041
m: 518-487-8256

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