Home > News > German ministry helps fund Dresden-based 32-/22-nm photomask lithography project
September 4th, 2008
German ministry helps fund Dresden-based 32-/22-nm photomask lithography project
Abstract:
In a move aimed to bolster Dresden's role as a center of excellence for advanced photomask development and engineering, the German Federal Ministry of Education and Research (BMBF) is funding a portion of a new joint venture in the area. Over the next two and a half years, the "Critical Dimension and Registration for 32-nm Mask Lithography" (CDuR32) cooperative project--a partnership of the Advanced Mask Technology Center (AMTC), Vistec Semiconductor Systems, and the German Metrology Institute (PTB)--will develop mask and measurement technologies for 32-nm memory chip and 22-nm microprocessor generations.
CDuR32 is aligned with the goals of the European research support platform (ENIAC) and will help expand Europe's position in nanoelectronics, according to the participants. The project will have a budget of Euro 16.7 million (of which BMBF contributes Euro 7.9 million) and will also help create new and maintain already existing, highly qualified jobs.
The three project partners have specific roles: AMTC (a joint venture of AMD, Qimonda, and Toppan Photomasks) analyzes and develops the basic principles of manufacturing 32-/22-nm masks; Vistec's new-generation measurement system (LMS IPRO5) will help meet the stringent requirements of qualifying accurate mask structures; and PTB contributes measurement capabilities and new mathematical analysis methods to help solve mask quality issues, such as the definition and characterization of measurement and calibration guidelines.
Source:
fabtech.org
Bookmark:
| Related News Press |
News and information
Closing the gaps — MXene-coating filters can enhance performance and reusability February 28th, 2025
Rice researchers harness gravity to create low-cost device for rapid cell analysis February 28th, 2025
Govt.-Legislation/Regulation/Funding/Policy
Rice researchers harness gravity to create low-cost device for rapid cell analysis February 28th, 2025
Quantum engineers ‘squeeze’ laser frequency combs to make more sensitive gas sensors January 17th, 2025
Chainmail-like material could be the future of armor: First 2D mechanically interlocked polymer exhibits exceptional flexibility and strength January 17th, 2025
Chip Technology
New ocelot chip makes strides in quantum computing: Based on "cat qubits," the technology provides a new way to reduce quantum errors February 28th, 2025
Enhancing transverse thermoelectric conversion performance in magnetic materials with tilted structural design: A new approach to developing practical thermoelectric technologies December 13th, 2024
Bringing the power of tabletop precision lasers for quantum science to the chip scale December 13th, 2024
Announcements
Closing the gaps — MXene-coating filters can enhance performance and reusability February 28th, 2025
Rice researchers harness gravity to create low-cost device for rapid cell analysis February 28th, 2025
Printing/Lithography/Inkjet/Inks/Bio-printing/Dyes
Presenting: Ultrasound-based printing of 3D materials—potentially inside the body December 8th, 2023
Simple ballpoint pen can write custom LEDs August 11th, 2023
Disposable electronics on a simple sheet of paper October 7th, 2022
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||