Home > News > Schemes strip cost out of chip R&D
July 16th, 2007
Schemes strip cost out of chip R&D
Abstract:
A startup will surface at Semicon West here today with a portfolio of technologies that it says can speed chip designs and processes from lab to fab, reining in runaway R&D costs and even allowing the function to be outsourced. The approach is just one of a host of initiatives being pitched to remake the chip industry's research-and-development model.
Intermolecular Inc. (San Jose, Calif.) says its High-Productivity Combinatorial (HPC) platform of "fab in a lab" technologies will facilitate R&D of IC materials, processes and device structures. The startup is offering a trio of programs.
Source:
eetimes.com
| Related News Press |
Chip Technology
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025
Programmable electron-induced color router array May 14th, 2025
Interviews/Book Reviews/Essays/Reports/Podcasts/Journals/White papers/Posters
Spinel-type sulfide semiconductors to operate the next-generation LEDs and solar cells For solar-cell absorbers and green-LED source October 3rd, 2025
Rice membrane extracts lithium from brines with greater speed, less waste October 3rd, 2025
Tools
Japan launches fully domestically produced quantum computer: Expo visitors to experience quantum computing firsthand August 8th, 2025
Rice researchers harness gravity to create low-cost device for rapid cell analysis February 28th, 2025
|
|
||
|
|
||
| The latest news from around the world, FREE | ||
|
|
||
|
|
||
| Premium Products | ||
|
|
||
|
Only the news you want to read!
Learn More |
||
|
|
||
|
Full-service, expert consulting
Learn More |
||
|
|
||