Home > News > NEXX Systems to Participate in IMEC's Industrial ...
December 12th, 2006
NEXX Systems to Participate in IMEC's Industrial ...
Abstract:
NEXX Systems today announced its participation in IMEC's Industrial Affiliation Program (IIAP) for 3D wafer level packaging and integrated passive devices. This research agreement continues NEXX Systems' long-term, successful relationship with IMEC, which in the past has included the development of novel interconnection and packaging processes on Cu/low-k back-end-of-line (BEOL) integrated circuits (on a Nimbus system), and "above IC" wiring and passive components (on a Stratus system).
Source:
businesswire.com
Bookmark:
| Related News Press |
Chip Technology
A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025
Programmable electron-induced color router array May 14th, 2025
Enhancing power factor of p- and n-type single-walled carbon nanotubes April 25th, 2025
Ultrafast plasmon-enhanced magnetic bit switching at the nanoscale April 25th, 2025
Announcements
Electrifying results shed light on graphene foam as a potential material for lab grown cartilage June 6th, 2025
Quantum computers simulate fundamental physics: shedding light on the building blocks of nature June 6th, 2025
A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||