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December 12th, 2006
NEXX Systems to Participate in IMEC's Industrial ...
Abstract:
NEXX Systems today announced its participation in IMEC's Industrial Affiliation Program (IIAP) for 3D wafer level packaging and integrated passive devices. This research agreement continues NEXX Systems' long-term, successful relationship with IMEC, which in the past has included the development of novel interconnection and packaging processes on Cu/low-k back-end-of-line (BEOL) integrated circuits (on a Nimbus system), and "above IC" wiring and passive components (on a Stratus system).
Source:
businesswire.com
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