Home > News > Canadian NanoFab installing SUSS wafer bonder
November 22nd, 2006
Canadian NanoFab installing SUSS wafer bonder
Abstract:
SUSS MicroTec, the Munich, Germany-based supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced that the University of Alberta's NanoFab has selected its new ELAN CB6L wafer bonding equipment for its research and production activities.
Source:
smalltimes.com
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