Home > News > SMTA International Emerging Technologies Summit
May 29th, 2006
SMTA International Emerging Technologies Summit
Abstract:
SMTA is again co-locating its annual conference, SMTA International, with the Assembly Tech Expo (ATExpo) show this fall.
The first session, Packaging Space: Nano to Outer, will feature papers on Emerging Trends Overview, Bonding Techniques in Wafer Fabrication, Flip Chip Integration of a Large Format Array of MOEMS Devices for Space Infrared Astronomy, Multiscale Assembly and Packaging System for MOEMS, and Nanotechnology and Room Temperature Assembly.
Source:
emsnow.com
Bookmark:
| Related News Press |
Chip Technology
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
New discovery aims to improve the design of microelectronic devices September 13th, 2024
Groundbreaking precision in single-molecule optoelectronics August 16th, 2024
Announcements
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
Turning up the signal November 8th, 2024
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||