Home > News > Large-scale fabrication of integrated nanoelectronic devices
March 14th, 2006
Large-scale fabrication of integrated nanoelectronic devices
Abstract:
A new methodology for integrating nanowires with micropatterned substrates using directed assembly and nanoscale soldering was developed by researchers at Johns Hopkins University in Baltimore. This overcomes the difficulty in making electrical contacts to nanoparticles, which so far has been a major limitation to fabricating integrated nanoelectronic devices containing large numbers of nanoparticles.
Source:
i-newswire.com
Bookmark:
| Related Links |
| Related News Press |
Nanoelectronics
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022
Reduced power consumption in semiconductor devices September 23rd, 2022
Atomic level deposition to extend Moore’s law and beyond July 15th, 2022
Materials/Metamaterials/Magnetoresistance
Nanoscale CL thermometry with lanthanide-doped heavy-metal oxide in TEM March 8th, 2024
Focused ion beam technology: A single tool for a wide range of applications January 12th, 2024
Announcements
Nanotechnology: Flexible biosensors with modular design November 8th, 2024
Exosomes: A potential biomarker and therapeutic target in diabetic cardiomyopathy November 8th, 2024
Turning up the signal November 8th, 2024
Nanofibrous metal oxide semiconductor for sensory face November 8th, 2024
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||