Home > News > Carbon nanofibre forest cuts thermal resistance
November 23rd, 2005
Carbon nanofibre forest cuts thermal resistance
Abstract:
NASA is using carbon nanotubes to cut thermal resistance, aiming to improve heat flow between chips and heatsinks. With conventional smooth heatsink surfaces “thermal conductivity is poor because of surface roughness”, Dr Jun Li of NASA’s Ames Research Center told Electronics Weekly. “Normally you have to put on grease or to solder with a eutectic to make it better.” Li’s alternative uses a form of nanotube called carbon nanofibres in the interface.
Source:
electronicsweekly.com
Bookmark:
| Related Links |
| Related News Press |
Nanotubes/Buckyballs/Fullerenes/Nanorods/Nanostrings
Chainmail-like material could be the future of armor: First 2D mechanically interlocked polymer exhibits exceptional flexibility and strength January 17th, 2025
Innovative biomimetic superhydrophobic coating combines repair and buffering properties for superior anti-erosion December 13th, 2024
Nanoelectronics
Interdisciplinary: Rice team tackles the future of semiconductors Multiferroics could be the key to ultralow-energy computing October 6th, 2023
Key element for a scalable quantum computer: Physicists from Forschungszentrum Jülich and RWTH Aachen University demonstrate electron transport on a quantum chip September 23rd, 2022
Reduced power consumption in semiconductor devices September 23rd, 2022
Atomic level deposition to extend Moore’s law and beyond July 15th, 2022
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||