Home > News > Bell Labs takes the heat out of chips
March 30th, 2005
Bell Labs takes the heat out of chips
Abstract:
Bell Labs has begun a project to use its 'nanograss' nanostructured surfaces in a liquid cooling system for chips, which has the potential to dissipate powers of greater than 100W/cm sq.
A droplet of fluid resting on a 'nanograss' surface doesn't seep down between the pillars, reducing the contact area by up to a factor of 50 compared with planar silicon.
Source:
electronicsweekly.com
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