Home > News > Applied Materials launches 45nm copper barrier/seed technology
December 1st, 2004
Applied Materials launches 45nm copper barrier/seed technology
Abstract:
The system is fully qualified and slated for 65nm production by a major chipmaker.
Source:
eetimes
Bookmark:
| Related News Press |
Chip Technology
A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025
Programmable electron-induced color router array May 14th, 2025
Enhancing power factor of p- and n-type single-walled carbon nanotubes April 25th, 2025
Ultrafast plasmon-enhanced magnetic bit switching at the nanoscale April 25th, 2025
Announcements
Electrifying results shed light on graphene foam as a potential material for lab grown cartilage June 6th, 2025
Quantum computers simulate fundamental physics: shedding light on the building blocks of nature June 6th, 2025
A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||