Home > News > Applied Materials launches 45nm copper barrier/seed technology
December 1st, 2004
Applied Materials launches 45nm copper barrier/seed technology
Abstract:
The system is fully qualified and slated for 65nm production by a major chipmaker.
Source:
eetimes
Bookmark:
| Related News Press |
Chip Technology
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025
Programmable electron-induced color router array May 14th, 2025
Announcements
Rice membrane extracts lithium from brines with greater speed, less waste October 3rd, 2025
Researchers develop molecular qubits that communicate at telecom frequencies October 3rd, 2025
Next-generation quantum communication October 3rd, 2025
"Nanoreactor" cage uses visible light for catalytic and ultra-selective cross-cycloadditions October 3rd, 2025
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||