Home > News > AMD selects Axcelis for new single-wafer implant technology
November 30th, 2004
AMD selects Axcelis for new single-wafer implant technology
Abstract:
Axcelis Technologies, Inc. today announced that it will provide innovative low energy, single-wafer implant technology to AMD's new 300mm fab in Dresden, Germany. AMD chose Axcelis' new single-wafer technology because it is the only platform that meets the chipmaker's device manufacturing requirements for well and channel and high-tilt HALO implant applications in the 90nm to 45nm technology nodes.
Source:
Axcelis
Bookmark:
| Related News Press |
Investments/IPO's/Splits
Daikin Industries becomes OCSiAl shareholder July 27th, 2021
INBRAIN Neuroelectronics raises over €14M to develop smart graphene-based neural implants for personalised therapies in brain disorders March 26th, 2021
180 Degree Capital Corp. Issues Second Open Letter to the Board and Shareholders of Enzo Biochem, Inc. March 26th, 2021
Chip Technology
Lab to industry: InSe wafer-scale breakthrough for future electronics August 8th, 2025
A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025
Programmable electron-induced color router array May 14th, 2025
Announcements
Rice membrane extracts lithium from brines with greater speed, less waste October 3rd, 2025
Researchers develop molecular qubits that communicate at telecom frequencies October 3rd, 2025
Next-generation quantum communication October 3rd, 2025
"Nanoreactor" cage uses visible light for catalytic and ultra-selective cross-cycloadditions October 3rd, 2025
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||