Home > News > Breaking Into The Third Dimension Of Computer Chip Design
November 26th, 2003
Breaking Into The Third Dimension Of Computer Chip Design
Abstract:
Despite continuous technical advances in the semiconductor industry, microchips are still composed of laterally-arranged (side-by-side) transistors on a silicon substrate. EUREKA project E! 2259 VSI developed new ways to break through this two dimensional approach and the restrictions it imposes by designing 3-D chips or Vertical System Integration (VSI). This technology has immediate security benefits which are very desirable since chip cards often contain secure information or monetary values and, therefore, are subject to attack by hackers.
Source:
* AlphaGalileo
Bookmark:
| Related News Press |
Chip Technology
A 1960s idea inspires NBI researchers to study hitherto inaccessible quantum states June 6th, 2025
Programmable electron-induced color router array May 14th, 2025
Enhancing power factor of p- and n-type single-walled carbon nanotubes April 25th, 2025
Ultrafast plasmon-enhanced magnetic bit switching at the nanoscale April 25th, 2025
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||