Nanotechnology Now - Press Release: EV Group to Expand Presence in Korea With Opening of Subsidiary to Bolster Growing R&D and High-Volume Manufacturing Efforts

Home > Press > EV Group to Expand Presence in Korea With Opening of Subsidiary to Bolster Growing R&D and High-Volume Manufacturing Efforts

Abstract:
EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced that it will open a new subsidiary in Seoul, Korea. The new subsidiary will serve as a direct-to-customer site for sales, service and support efforts for EVG's existing and potential new customer base. Until now, EVG's presence in Korea was via both its distribution and R&D partners. This move is set to place EVG on the ground to meet the growing demands for the company's technologies around the clock or 24/7.

EV Group to Expand Presence in Korea With Opening of Subsidiary to Bolster Growing R&D and High-Volume Manufacturing Efforts

ST. FLORIAN, Austria | Posted on May 14th, 2008

Commenting on today's announcement, Hermann Waltl, EVG's senior vice president of sales, noted, "We are highly committed to establishing and sustaining partnerships with our customers. The opening of our own subsidiary in Korea affords us a great opportunity to continue delivering on that commitment in this burgeoning market for EVG. The growth we've seen in our customer base thus far, coupled with the market potential, makes this move a clear and natural progression for us. Moreover, as Korea continues to increase its technological development efforts to aggressively compete in the global semiconductor and MEMS arenas, the region is a hotbed for adoption of the latest enabling manufacturing technologies. This creates significant market potential for EVG, particularly in areas such as 3D stacking, advanced chip-to-wafer integration, as well as wafer-to-wafer bonding. So, naturally, the opportunities and benefits of establishing ground operations here are manifold."

Independent of EVG's efforts within this region, the company has had an active role in Korea for the last decade. Specifically, EVG has collaborated with Jinsan Scientific Co. Ltd. and Jinsan Micro-engineering Ltd. to open a cleanroom facility, known as JML lab. This facility is designed to capture R&D efforts for MEMS, advanced packaging and nanoimprint lithography applications, as well as serve as a demonstration center for EVG's Korean customer base. In addition, the company is in close partnership with the BioIT National Foundry Center, which was established by Korea's Ministry of Commerce, Industry and Energy. The Center is based at Seoul National University (SNU) -- one of the three national universities focused on transforming local industries into high-value-added industries of the future. The Center at SNU is specifically dedicated to research and development surrounding biotechnology, including lab-on-a-chip.

EVG's new Korean subsidiary will house myriad functions, including sales, service, process/application and administrative capabilities.

EV Group Korea Ltd. will be located in Room 302, 3rd Floor, ILJIN Building, BanPo-Dong 97-4, SeoCho-Gu, Seoul, Korea, 137-040. Please contact Eugene Lee, Brian Park or Michael Kim for more information at: or .

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About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for major ICs and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. The company's vertical infrastructure allows EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume.

EVG is a registered trademark of EV Group. All other trademarks or registered trademarks mentioned in this release are the property of their respective holders.

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