Home > News > SUSS Wafer Bonding Equipment Selected
November 10th, 2005
SUSS Wafer Bonding Equipment Selected
Abstract:
Today SUSS MicroTec announced Purdue University has purchased a SUSS SB6e Substrate Bonder and a MA/BA6, Mask / Bond Aligner for use in Purdue's new Birck Nanotechnology Center.
Source:
businesswire
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