Home > News > New hybrid material has potential use in microelectronics
October 10th, 2003
New hybrid material has potential use in microelectronics
Abstract:
U of T scientists have developed a new class of hybrid materials combining organic and inorganic elements that could lead to improved computer chips, among other applications. The material is a porous solid that assembles itself at the molecular level and displays superior insulating properties to silica; it is categorized as a nanocomposite because the nanoscale pore size of its honeycomb-like structure is so tiny, measuring in the billionths of a metre in diameter and organic and inorganic parts are integrated into a composite structure.
Source:
EurekAlert
Bookmark:
| Related News Press |
Discoveries
Deciphering local microstrain-induced optimization of asymmetric Fe single atomic sites for efficient oxygen reduction August 8th, 2025
ICFO researchers overcome long-standing bottleneck in single photon detection with twisted 2D materials August 8th, 2025
New molecular technology targets tumors and simultaneously silences two ‘undruggable’ cancer genes August 8th, 2025
Simple algorithm paired with standard imaging tool could predict failure in lithium metal batteries August 8th, 2025
 |
||
 |
||
| The latest news from around the world, FREE | ||
 |
||
|
|
||
| Premium Products | ||
 |
||
|
Only the news you want to read!
Learn More |
||
 |
||
|
Full-service, expert consulting
Learn More |
||
|
|
||